System and method for inspecting a wafer

ABSTRACT

An inspection system for inspecting a semiconductor wafer. The inspection system comprises an illumination setup for supplying broadband illumination. The broadband illumination can be of different contrasts, for example brightfield and darkfield broadband illumination. The inspection system further comprises a first image capture device and a second image capture device, each configured for receiving broadband illumination to capture images of the semiconductor wafer while the semiconductor wafer is in motion. The system comprises a number of tube lenses for enabling collimation of the broadband illumination. The system also comprises a stabilizing mechanism and an objective lens assembly. The system further comprises a thin line illumination emitter and a third image capture device for receiving thin line illumination to thereby capture three-dimensional images of the semiconductor wafer. The system comprises a reflector assembly for enabling the third image capture device to receive illumination reflected from the semiconductor wafer in multiple directions.

RELATED APPLICATIONS

The present application is a continuation of U.S. application Ser. No.12/657,068, filed Jan. 13, 2010 claims priorities of Singaporeapplication numbers 200901109-9, filed Feb. 16, 2009 and 200900229-6,filed Jan. 13, 2009, the disclosures of which are hereby incorporated byreference herein in their entirety.

FIELD OF INVENTION

The present invention relates generally to a wafer inspection process.More specifically, the present invention relates to an automated systemand method for inspecting semiconductor components.

BACKGROUND

The ability to ensure a consistently high quality of manufacturedsemiconductor components, for example semiconductor wafers and dies, isincreasingly crucial in the semiconductor industry. Semiconductor waferfabrication techniques have been consistently improved to incorporate anincreasing number of features into a smaller surface area of thesemiconductor wafer. Accordingly, the photolithographic processes usedfor semiconductor wafer fabrication has become more sophisticated toallow the incorporation of increasing features to the smaller surfacearea of the semiconductor wafer (i.e. higher performance of thesemiconductor wafer). Consequently, sizes of potential defects onsemiconductor wafers are typically in the micron to submicron range.

It is evident that manufacturers of semiconductor wafers have anincreasingly pressing need to improve semiconductor wafer qualitycontrol and inspection procedures to ensure a consistently high qualityof manufactured semiconductor wafers. Semiconductor wafers are typicallyinspected for detecting defects thereon, such as presence of surfaceparticulates, imperfections, undulations and other irregularities. Suchdefects could affect eventual performance of the semiconductor wafers.Therefore, it is critical to eliminate or extract defectivesemiconductor wafers during the manufacture thereof.

There have been advances in semiconductor inspection systems andprocesses. For example, higher resolution imaging systems, fastercomputers, and enhanced precision mechanical handling systems have beencommissioned. In addition, semiconductor wafer inspection systems,methods and techniques have historically utilized at least one ofbrightfield illumination, darkfield illumination and spatial filteringtechniques.

With brightfield imaging, small particles on the semiconductor waferscatter light away from a collecting aperture of an image capturedevice, thereby resulting in a reduction of returned energy to the imagecapture device. When the particle is small in comparison with theoptical point spread function of a lens or digitalizing pixel,brightfield energy from the immediate areas surrounding the particlegenerally contribute a large amount of energy relative to the particle,thereby making the particle difficult to detect. In addition, the verysmall reduction in energy due to the small particle size is often maskedby reflectivity variations from the immediate areas around the particlethereby resulting in increased occurrences of false defect detection. Toovercome the above phenomena, semiconductor inspection systems have beenequipped with high-end cameras with larger resolutions, which captureimages of smaller surface areas of the semiconductor wafer. However,brightfield images generally have a better pixel contrast and this isadvantageous for estimating size of defects and when inspecting darkdefects.

Darkfield illumination and its advantages are generally well known inthe art. Darkfield imaging has been employed with several existingsemiconductor wafer inspection systems. Darkfield imaging typicallydepends on the angle at which light rays are incident on the object tobe inspected. At a low angle to a horizontal plane of the object to beinspected (for example 3 to 30 degrees), darkfield imaging typicallyproduces a dark image except at locations where defects, such as surfaceparticulates, imperfections and other irregularities exist. A particularuse of darkfield imaging is to light up defects which sizes are smallerthan the resolving power of lens used to produce a brightfield image. Ata higher angle to the horizontal plane (for example 30 to 85 degrees),darkfield imaging typically produces better contrast images compared tobrightfield images. A particular use of such high angle darkfieldimaging enhances contrast of surface irregularities on a mirror finishor transparent object. In addition, high angle darkfield imagingenhances imaging of tilted objects.

Light reflectivity of the semiconductor wafer typically has asignificant effect on quality of image obtained with each of brightfieldand darkfield imaging. Both micro and macro structures present on thesemiconductor wafer affect the light reflectivity of the semiconductorwafer. Generally, amount of light reflected by the semiconductor waferis a function of the direction or angle of incident light, the viewingdirection and the light reflectivity of the surface of the semiconductorwafer. The light reflectivity is in turn dependent on wavelength of theincident light and material composition of the semiconductor wafer.

It is generally difficult to control the light reflectivity ofsemiconductor wafers presented for inspection. This is because thesemiconductor wafer may consist of several layers of material. Eachlayer of material may transmit different wavelengths of lightdifferently, for example at different speeds. In addition, layers mayhave different light permeabilities, or even reflectivity. Accordingly,it will be apparent to a person skilled in the art that the use of lightor illumination of a single wavelength or a narrow band of wavelengthstypically adversely affects quality of captured images. Need forfrequent modification of the single wavelength or narrow band ofwavelengths requires use of multiple spatial filters or wavelengthtuners, which can generally inconvenient. To alleviate such problems, itis important to use a broadband illumination (i.e. illumination of awide range of wavelengths), for example broadband illumination of arange of wavelengths between 300 nm and 1000 nm.

Broadband illumination is important for achieving high quality images aswell as for handling wafers with a wide range of surface reflectivities.In addition, defect detection capabilities of wafer inspections systemswill generally be enhanced by use of multiple illumination angles, forexample use of both brightfield and darkfield illuminations. Existingwafer systems in the market do not utilize illuminations at multipleangles and with a full broadband wavelength.

Currently available wafer inspection systems or equipments typically useone of the following methods for achieve multiple responses during waferinspection:

(1) Multiple Image Capture Devices with Multiple Illuminations (MICD)

The MICD uses a plurality of image capture devices and a plurality ofilluminations. The MCID is based on the principle of segmenting thewavelength spectrum into narrow bands, and allocating each segmentedwavelength spectrum to individual illuminations. During design ofsystems employing the MICD method, each image capture device is pairedwith a corresponding illumination (i.e. illumination source), togetherwith corresponding optical accessories such as a spatial filter or aspecially coated beam splitter. For example, wavelength of thebrightfield is limited between 400 to 600 nm using mercury arc lamp andspatial filter and the darkfield is limited between 650 to 700 nm usinglasers. The MICD method experiences disadvantages, for example inferiorimage quality and design inflexibility. Inferior image quality is due tovarying surface reflectivities of inspected wafers, combined with theuse of illuminations with narrow wavelengths. Design inflexibilityoccurs because the modification of the wavelength of a singleillumination typically requires reconfiguration of the entire opticalsetup of the wafer inspection system. In addition, the MICD methodtypically does not allow capture of illuminations with varyingwavelengths by a single image capture device without comprising qualityof captured images.

(2) Single Image Capture Device with Multiple Illuminations (SICD)

The SICD method uses a single image capture device for capturingmultiple illuminations, either with segmented wavelengths or broadbandwavelengths. However, it is not possible to obtain multiple illuminationresponses simultaneously while the wafer is in motion. In other words,the SICD method only allows one illumination response when the wafer isin motion. To achieve multiple illumination responses, the SICD methodrequires image captures while the wafer is stationary, which affectsthroughput of the wafer inspection system.

Semiconductor wafer inspection systems employing simultaneous,independent, on-the-fly image capture using broadband brightfield anddarkfield or in general multiple illuminations and using multiple imagecapture devices are not presently available due to a relative lack ofunderstanding as to actual implementation and operating advantagesthereof. Existing semiconductor wafer inspection systems are employingeither MICD or

SICD as explained earlier. Equipments employing MICD do not usebroadband and suffer from inferior image quality and inflexible systemsetup. On the other hand equipments using SICD experiences diminishedsystem throughput and incapable of obtaining on-the-fly simultaneousmultiple illumination responses.

An exemplary existing semiconductor wafer optical inspection system thatutilizes both brightfield illumination and darkfield illuminator isdisclosed in U.S. Pat. No. 5,822,055 (KLA1). An embodiment of theoptical inspection system disclosed in KLA1 utilizes MICD as explainedearlier. It uses multiple cameras to capture separate brightfield anddarkfield images of semiconductor wafers. Captured brightfield anddarkfield images are then processed separately or together for detectingdefects on the semiconductor wafer. In addition, the optical inspectionsystem of KLA1 captures brightfield and darkfield images simultaneouslyusing separate sources of brightfield and darkfield illumination. KLA1achieves simultaneous image capture using segmentation of illuminationwavelength spectrum, narrow band illumination sources and spatialfilters for enabling capture of the brightfield and darkfield images. Inthe KLA1-optical system, one of the cameras is configured to receivedarkfield imaging using narrow band laser and spatial filter. The othercamera is configured to receive rest of the wavelength spectrum usingbrightfield illumination and a beam splitter with special coating.Disadvantages of the optical inspection system disclosed by KLA1 includeunsuitability thereof for imaging different semiconductor waferscomprising a large variation of surface reflectivities due tosegmentation of the wavelength spectrum. The cameras are tightly coupledwith respective illumination and there is no flexibility of combining ofmore than one available illumination to enhance certain wafer types. Onesuch type is having carbon coated layer on its front side and theyexhibit poor reflection characteristics at certain illumination angle,for example using brightfield alone. It requires combination ofbrightfield and high angle darkfield illumination to view certaindefects. Accordingly, the optical inspection system of KLA1 requires aplurality of light or illumination sources and filters for performingmultiple inspection passes (multiple scan which in turn affects thethroughput of the system) to thereby capture multiple brightfield anddarkfield images.

Additional exemplary exiting optical inspection systems utilizing bothbrightfield and darkfield imaging are disclosed in U.S. Pat. No.6,826,298 (AUGTECH1) and U.S. Pat. No. 6,937,753 (AUGTECH2). Darkfieldimaging of the optical inspection systems of AUGTECH1 and AUGTECH2utilizes a plurality of lasers for low-angle darkfield imaging, and afiber optic ring light for high-angle darkfield imaging. In addition,the optical inspection system of AUGTECH1 and AUGTECH2 uses a singlecamera sensor and belongs to SICD method explained earlier. Accordingly,inspection of semiconductor wafers in AUGTECH1 and AUGTECH2 is performedeither by brightfield imaging or by darkfield imaging or via acombination of both brightfield imaging and darkfield imaging whereineach of the brightfield imaging and darkfield imaging is performed whenthe other is completed. The inspection system of AUGTECH1 and AUGTECH2is not capable of simultaneous, on-the-fly or while wafer is in motionand independent brightfield and darkfield imaging. Accordingly, multiplepasses of each semiconductor wafer is required for completing inspectionthereof, resulting in lowered manufacturing throughput and increasedutilization of resources.

In addition, several existing optical inspection systems utilize agolden image or a reference image for comparison with newly acquiredimages of semiconductor wafers. Derivation of the reference imagetypically requires capturing several images of known or manuallyselected “good” semiconductor wafers and then applying a statisticalformula or technique to thereby derive the reference image. Adisadvantage with the above derivation is that inaccuracies orinconsistencies in manual selection of the “good” semiconductor wafers.Optical inspection systems using such reference images typically sufferfrom false rejects of semiconductor wafers due to inaccurate orinconsistent reference images. With increasingly complex circuitgeometry of semiconductor wafers, reliance on manual selection of “good”semiconductor wafers for deriving reference images is increasinglyincompatible with increasingly high quality standards set by thesemiconductor inspection industry.

Deriving a golden reference image involves many statistical techniquesand calculations. Most of the statistical techniques are very generaland have their own merits. State of the art of the currently availableequipments uses either average or mean together with standard deviationto calculate a golden reference pixel. This method works well with knowngood pixels; otherwise any defect or noise pixel would interfere andaffects final average or mean value of the reference pixel. Anothermethod is to use median and it has reduced interference due to noisepixel but is not possible to eliminate the effect of noisesubstantially. All of the available equipments try to reduce the errorby applying different kinds of statistical techniques such as mean,median among others, but they do not have any special or user friendlysequence to eliminate the error. Such special sequence certainly helpsto eliminate pixels, which would affect the final reference pixel value.

U.S. Pat. No. 6,324,298 (AUGTECH3) discloses a training method forcreating a golden reference or reference image for use in semiconductorwafer inspection. The method disclosed in AUGTECH3 requires “Known GoodQuality” or “Defect Free” wafers. Selection of such wafers is manuallyor user performed. Statistical formulas or techniques are then appliedfor deriving the reference image. As such, accurate and consistentselection of “good quality” wafers is crucial for accurate andconsistent quality of semiconductor inspection. Further, AUGTECH3 usesmean and standard deviation to calculate individual pixels of thereference image and presence of any defective pixel will lead toinaccurate reference pixel. The defective pixel occurs due to foreignmatter or other defects, which would confuse the statistical calculationand leads to incorrect reference pixel. It will be apparent to a personskilled in the art that the method of AUGTECH3 is open to inaccuracies,inconsistencies and errors in inspection of the semiconductor wafers.

In addition, optical inspection system disclosed in AUGTECH3 uses aflash or strobe lamp for illuminating the semiconductor wafers. It willbe appreciated by a person skilled in the art that inconsistenciesbetween different flashes or strobes may occur due to numerous factorsincluding, but not limited to, temperature differentials, electronicinconsistencies and differential flash or strobe intensities. Suchdifferentials and inconsistencies are inherent even with “good”semiconductor wafers. Presence of such differentials would affect thequality of golden reference image if the system had not taken care ofsuch differentials due to flash lamp. In addition, illuminationintensity and uniformity varies across the surface of the semiconductorwafer due to factors including, but not limited to planarity of thewafer, mounting and light reflectivity at different positions of thesurface. Without taking into account the variations in the flashintensity and the strobing characteristics of the lamp, any referenceimages generated in the above-described manner may be unreliable andinaccurate when used for comparing with captured images of differentpositions of the semiconductor wafers.

Variations in product specifications, for example semiconductor wafersize, complexity, surface reflectivity and criteria for qualityinspection, are common in the semiconductor industry. Accordingly,semiconductor wafer inspection systems and methods need to be capable ofinspecting such variations in product specifications. However, existingsemiconductor wafer inspection systems and methods are generallyincapable of satisfactorily inspecting such variations in productspecifications, especially given the increasing quality standards set bythe semiconductor industry.

For example, a typical existing semiconductor wafer inspection systemuses a conventional optical assembly comprising components, for examplecameras, illuminators, filters, polarizers, mirrors and lens, which havefixed spatial positions.

Introduction or removal of components of the optical assembly generallyrequires rearrangement and redesign of the entire optical assembly.Accordingly, such semiconductor wafer inspection systems have inflexibledesigns or configurations, and require a relatively long lead-time formodification thereof. In addition, distance between objective lens ofthe convention optical assembly and semiconductor wafer presented forinspection is typically too short to allow ease of introduction of fiberoptics illumination with differing angles for darkfield illumination.

There are numerous other existing semiconductor wafer inspection systemsand methods. However, because of current lack of technical expertise andoperational know-how, existing semiconductor wafer inspection systemscannot employ simultaneous brightfield and darkfield imaging for aninspection while the wafer is in motion, while still having design andconfigurationally flexible. There is also a need for semiconductor waferinspection systems and methods for enabling resource-efficient,flexible, accurate and fast inspection of semiconductor wafers. This isespecially given the increasing complexity of electrical circuitry ofsemiconductor wafers and the increasing quality standards of thesemiconductor industry.

SUMMARY

There is currently a lack of semiconductor wafer inspection systems andmethods capable of employing both brightfield and darkfield imagingsimultaneously and independently for performing inspection while thesemiconductor wafer is in motion, while providing configurational ordesign flexibility. In addition, there is need for a semiconductor waferinspection system wherein components thereof, for example illuminators,camera, objective lens, filters and mirrors, have flexible andadjustable spatial interconfigurations. Given the increasing complexityof electrical circuitry of semiconductor wafers, and the increasingquality standards set by the semiconductor industry, accuracy andconsistency of semiconductor wafer inspection is increasingly critical.Derivation of golden references or reference images for comparison withcaptured images of semiconductor wafers currently require manualselection of “good” semiconductor wafers. Such a manual selection canresult in inaccuracies and inconsistencies in the derived referenceimages, and therefore consequent inspection of semiconductor wafers.Accordingly, there is a need for improved training methods or processesfor deriving reference images to which subsequent captured images ofsemiconductor wafers can be compared. The present invention seeks toaddress at least one of the above-described issues.

Embodiments of the present invention provide an inspection system andmethod for inspecting semiconductor components, including, but notlimited to semiconductor wafers, dies, LED chips and solar wafers. Theinspection system is designed for performing 2-Dimensional (2D) and3-Dimensional (3D) wafer inspection. The inspection system is furtherdesigned for performing defect review.

The 2D wafer inspection is facilitated by a 2D optical module, whichcomprises at least two image capture devices. The 2D wafer inspectionutilizes at least two different contrast illuminations for capturingimages of corresponding contrast illuminations. The 2D wafer inspectionis performed while the wafer is in motion, and is completed with onepass. The 3D wafer inspection is facilitated by a 3D optical module,which comprises at least one image capture device and at least one thinline illuminator. Thin line illumination supplied by the thin lineilluminator, which is either laser or broadband illumination source orboth, is directed at the semiconductor wafer while the semiconductorwafer is in motion for capturing 3D images of the semiconductor wafer.Defect review performed by the inspection system is facilitated by adefect review optical module.

In accordance with a first aspect of the embodiments of the presentinvention, there is disclosed an inspection system comprising anillumination setup for supplying a first broadband illumination and asecond broadband illumination, a first image capture module forreceiving at least one of the first broadband illumination and thesecond broadband illumination reflected from a wafer and a second imagecapture device for receiving at least one of the first broadbandillumination and the second broadband illumination reflected from thewafer. The first image capture device and the second image capturedevice are configured for sequentially receiving at least one of thefirst broadband illumination and the second broadband illumination tocapture a first image and a second image of the wafer respectively. Thewafer is spatially displaced by a distance between capture of the firstimage and the second image.

In accordance with a second aspect of the embodiments of the presentinvention, there is disclosed a system for inspecting semiconductorcomponents comprising an illumination setup for supplying a broadbandfirst contrast illumination and a broadband second contrast illuminationand a plurality of image capture devices, each of the plurality of imagecapture devices capable of receiving each of the broadband firstcontrast illumination and the broadband second contrast illuminationreflected by a wafer. The plurality of image capture devices isconfigured for sequential receipt of one of the broadband first contrastillumination and the broadband second contrast illuminations for captureof a first contrast image and a second contrast image respectively ofthe wafer. The capture of the first contrast image and the capture ofthe second contrast image occur while the wafer is in motion.

In accordance with a third aspect of the embodiments of the presentinvention, there is disclosed an inspection system comprising a firstimage capture device for receiving at least one of a broadband firstcontrast illumination and a broadband second contrast illumination and asecond image capture device for receiving at least one of the broadbandfirst contrast illumination and the broadband second contrastillumination.

Receipt of the broadband first contrast illumination and the broadbandsecond contrast illumination by each of the first image capture deviceand the second image capture device enables capture of a first contrastimage and a second contrast image respectively of a wafer. The firstimage capture device and the second image capture device are spatiallyconfigured for enabling sequential capture of the first contrast imageand the second contrast image while the wafer is in motion.

In accordance with a fourth aspect of the embodiments of the presentinvention, there is disclosed an inspection system comprising anillumination setup for supplying a first broadband illumination, a firstimage capture module for receiving the first broadband illuminationreflected from a wafer for capturing a first image of the wafer and asecond image capture device for receiving the first broadbandillumination reflected from a wafer for capturing a second image of thewafer. The first image capture device and the second image capturedevice are configured for sequentially capturing the first image and thesecond image. The wafer is spatially displaced between capture of thefirst image and the second image. The spatial displacement issubsequently calculated based on encoder values in relation to each ofthe first image and the second image.

BRIEF DESCRIPTION OF THE DRAWINGS

Exemplary embodiments of the present invention are described hereinafterwith reference to the following drawings, in which:

FIG. 1 shows a partial plan view of an exemplary system for inspectingwafers according to an exemplary embodiment of the present invention;

FIG. 2 shows a partial isometric view of the system of FIG. 1;

FIG. 3 shows an exploded partial isometric view of an optical inspectionhead of the system of FIG. 1 according to view “A” highlighted in FIG.2;

FIG. 4 shows an exploded partial isometric view of a robotic wafer tableof the system of FIG. 1 according to view “B” highlighted in FIG. 2;

FIG. 5 shows an exploded partial isometric view of a robotic waferloader/unloader of the system of FIG. 1 according to view “C”highlighted in FIG. 2;

FIG. 6 shows an exploded partial isometric view of a wafer stack moduleof the system of FIG. 1 according to view “D” highlighted in FIG. 2;

FIG. 7 shows a partial isometric view of the optical inspection head ofthe system of FIG. 1;

FIG. 8 shows a partial front view of the optical inspection head of thesystem of FIG. 1;

FIG. 9 shows optical ray paths of illumination between a brightfieldilluminator, a low angle darkfield illuminator, a high angle darkfieldilluminator, a first image capture device and a second image capturedevice of the system of FIG. 1;

FIG. 10 is a flowchart of an exemplary first ray path followed by thebrightfield illumination supplied by the brightfield illuminator of FIG.9;

FIG. 11 is a flowchart of an exemplary second ray path followed by thedarkfield high angle illumination supplied by the high angle darkfieldilluminator of FIG. 9;

FIG. 12 is a flowchart of an exemplary third ray path followed by thedarkfield low angle illumination supplied by the low angle darkfieldilluminator of FIG. 9;

FIG. 13 shows ray path of illumination between a thin line illuminatorand a 3D image capture device or camera of the system of FIG. 1;

FIG. 14 shows optical ray path of illumination between a reviewbrightfield illuminator, a review darkfield illuminator and a reviewimage capture device of the system of FIG. 1;

FIG. 15 is a flowchart of an exemplary fourth ray path followed bybrightfield illumination between the review brightfield illuminator andthe review image capture device of FIG. 14;

FIG. 16 is a flowchart of an exemplary fifth ray path followed bydarkfield illumination between the review darkfield illuminator and thereview image capture device of FIG. 14;

FIG. 17 is a method flow diagram of an exemplary method for inspectingwafers provided by the present invention;

FIG. 18 is a process flowchart of an exemplary reference image creationprocess for creating reference images used for comparing with imagescaptured during performance of the method of FIG. 17;

FIG. 19 is a process flow diagram of an exemplary two-dimensioned waferscanning process with timing offset in the method step of the method ofFIG. 17;

FIG. 20 shows a table of illumination configurations selectable by anillumination configurator of the system of FIG. 1;

FIG. 21 shows a timing chart for capturing of a first image by the firstimage capture device and capturing of a second image by the second imagecapture device;

FIG. 22a shows the first image captured by the first image capturedevice of FIG. 1;

FIG. 22b shows the second image captured by the second image capturedevice of FIG. 1;

FIG. 22c shows a combined first image of FIG. 22a and second image ofFIG. 22b for demonstrating image offset due to the capture of the firstimage and the second image when the wafer is moving;

FIG. 23 is a process flow diagram of an exemplary two-dimensional imageprocessing process performed in a method step of the method of FIG. 17;

FIG. 24 is a process flow diagram of a first exemplary three-dimensionalwafer scanning process performed in a method step of the method of FIG.17;

FIG. 25 shows an exemplary optical ray path of illumination between athin line illuminator a 3D image capture device or camera of the systemof FIG. 1;

FIG. 26 is a process flow diagram of a second exemplary threedimensional wafer scanning process performed in a method step of themethod of FIG. 17; and

FIG. 27 is a process flow diagram of an exemplary review processperformed in a method step of the method of FIG. 17.

DETAILED DESCRIPTION

The inspection of semiconductor components, for example semiconductorwafers and dies, is an increasingly critical step in the manufacture orfabrication of semiconductor components. Increasing complexity ofcircuitry of semiconductor wafers, coupled with increasing qualitystandards for semiconductor wafers, has led to an increasing need forimproved semiconductor wafer inspection systems and methods.

There is currently a lack of semiconductor wafer inspection systems andmethods capable of employing both brightfield and darkfield imagingsimultaneously for performing on-the-fly inspection of semiconductorwafers, while providing configurational or design flexibility. Inaddition, there is need for a semiconductor wafer inspection systemwherein components thereof, for example illuminators, camera, objectivelens, filters and mirrors, have flexible and adjustable spatialinterconfigurations. Given the increasing complexity of electricalcircuitry of semiconductor wafers, and the increasing quality standardsset by the semiconductor industry, accuracy and consistency ofsemiconductor wafer inspection is increasingly critical. Derivation ofgolden references or reference images for comparison with capturedimages of semiconductor wafers currently require manual selection of“good” semiconductor wafers. Such a manual selection can result ininaccuracies and inconsistencies in the derived reference images, andtherefore consequent inspection of semiconductor wafers. Accordingly,there is a need for improved training methods or processes for derivingreference images to which subsequent captured images of semiconductorwafers can be compared.

Embodiments of the present invention provide exemplary systems andmethods for inspecting semiconductor components for addressing at leastone of the above-identified issues.

For purposes of brevity and clarity, the description of the embodimentsof the present invention is limited hereinafter to systems and methodsfor inspecting semiconductor wafers. It will however be understood by aperson skilled in the art that this does not preclude the presentinvention from other applications where fundamental principles prevalentamong the various embodiments of the present invention such asoperational, functional or performance characteristics are required. Forexample, the systems and methods provided by the present invention canbe used for inspecting other semiconductor components including, but notlimited to semiconductor dies, LED chips and solar wafers.

An exemplary system 10 for inspecting semiconductor wafers 12 as shownin FIG. 1 and FIG. 2 is provided according to a first embodiment of thepresent invention. The system 10 can also be used for inspecting othersemiconductor devices or components as required. Preferably, the system10 comprises an optical inspection head 14 (as shown in FIG. 3), a wafertransportation table or wafer chuck 16 (as shown in FIG. 4), a roboticwafer handler 18 (as shown in FIG. 5), a wafer stack module 20 (as shownin FIG. 6) or film frame cassette holder, an XY-displacement table 22,and at least one set of quad vibration isolators 24 (as shown in FIG. 1and FIG. 2).

The optical inspection head 14 as shown in FIG. 7 and FIG. 8 comprises anumber of illuminators and image capture devices. Preferably, theoptical inspection head 14 comprises a brightfield illuminator 26, a lowangle darkfield illuminator 28 and a high angle darkfield illuminator30. It will be understood by a person skilled in the art that additionaldarkfield illuminators may be incorporated into the system 10 asrequired. It will be further understood by a person skilled in the artthat the low angle darkfield illuminator 28 and the high angle darkfieldilluminator 30 may be integrated as a single darkfield illuminator,which may be flexibly positioned as required.

The brightfield illuminator 26, also known as a brightfield illuminationsource or a brightfield illumination emitter, supplies or emitsbrightfield illumination or light. The brightfield illuminator 26 is forexample, a flash lamp or a white light emitting diode. Preferably, thebrightfield illuminator 26 supplies broadband brightfield illuminationcomprising wavelengths of substantially between and including 300 nm and1000 nm. It will however be understood by a person skilled in the artthat the brightfield illumination may be of alternative wavelengths andoptical properties.

The brightfield illuminator 26 preferably comprises a first opticalfiber (not shown) through which the brightfield illumination travelsbefore being emitted from the brightfield illuminator 26. Preferably,the first optical fiber acts as a waveguide for guiding direction oftravel of brightfield illumination. Further preferably, the firstoptical fiber facilitates directing of the brightfield illuminationemitted from the brightfield illuminator 26.

The low angle darkfield illuminator 28 and the high angle darkfieldilluminator 30 are also known as darkfield illumination sources, andemits or supplies darkfield illumination. Darkfield illuminators arecarefully aligned illumination or light sources which enableminimization of the quantity of directly transmitted (or un-scattered)light entering their corresponding image capture devices. Generally,image capture devices for capturing darkfield images receives onlyillumination or light that has been scattered by a sample or object.Darkfield images generally have enhanced image contrast as compared tobrightfield images. Brightfield illumination and darkfield illuminationare examples of contrast illuminations.

The low angle darkfield illuminator 28 and the high angle darkfieldilluminator 30 are for example flash lamps or white light emittingdiodes. Preferably, the darkfield illumination supplied by each of thelow angle darkfield illuminator 28 and the high angle darkfieldilluminator 30 is of substantially similar optical properties as thebrightfield illumination. More specifically, the darkfield illuminationsupplied by each of the low angle darkfield illuminator 28 and the highangle darkfield illuminator 30 is preferably a broadband darkfieldillumination comprising a wavelength of substantially between andincluding 300 nm to 1000 nm. Alternatively, the low angle darkfieldilluminator 28 and the high angle darkfield illuminator 30 supplydarkfield illumination of different wavelengths or other opticalproperties

The low angle darkfield illuminator 28 is at a lower angle, as comparedto the high angle darkfield illuminator 30, to a horizontal plane of thesemiconductor wafer 12 placed on the wafer table 16 (or to a horizontalplane of the wafer table 16). For example, the low angle darkfieldilluminator 28 is preferably positioned at an angle of between three andthirty degrees to the horizontal plane of the semiconductor wafer 12placed on the wafer table 16. In addition, the high angle darkfieldilluminator 30 is preferably positioned at an angle of between thirtyand eighty-five degrees to a horizontal plane of the semiconductor wafer12 placed on the wafer table 16. The above-stated angles are preferablyalterable as required by adjusting the position of each of the low angledarkfield illuminator 28 and the high angle darkfield illuminator 30.

Each of the low angle darkfield illuminator 28 and the high angledarkfield illuminator 30 preferably comprises a second and third opticalfiber (not shown) through which the darkfield illumination travelsbefore being emitted therefrom. Both the second and third optical fibersacts as a waveguide for guiding direction of travel of the darkfieldillumination through each of the low angle darkfield illuminator 28 andthe high angle darkfield illuminator 30. In addition, the second opticalfiber facilitates directing of the darkfield illumination emitted fromthe low angle darkfield illuminator 28 and the third optical fiberfacilitates directing of the darkfield illumination emitted from thehigh angle darkfield illuminator 30. Illumination supplied by each ofthe brightfield illuminator 26, the low angle darkfield illuminator 28and the high angle darkfield illuminator 30 can be controlled, and canbe either continuously supplied or pulsed.

The wavelength spectrums of both the brightfield illumination anddarkfield illuminations preferably enhance accuracy of inspection anddefect detection of the semiconductor wafers 12. Broadband illuminationpreferably enables identification of a wide range of semiconductor waferdefect types with varying surface reflectivities. In addition, thesimilar broadband wavelengths of both the brightfield illumination andthe darkfield illuminations enable the inspection of the wafer 12 to beperformed independent of reflective characteristics of the semiconductorwafer 12. This means that the detection of defects on the semiconductorwafer 12 will preferably not be undesirably influenced due to differentsensitivities or reflectiveness or polarization of the semiconductorwafer 12 to different illumination wavelengths.

Preferably, intensities of the brightfield illumination and thedarkfield illumination supplied by the brightfield illuminator 26 andthe darkfield illuminators 28, 30 respectively can be selected andvaried as required depending on the semiconductor wafer 12characteristics, for example material of the semiconductor wafer 12. Inaddition, the intensities of each of the brightfield illumination anddarkfield illuminations can be selected and varied as required forenhancing quality of images captured of the semiconductor wafer 12, andfor enhancing inspection of the semiconductor wafer 12.

As shown in FIG. 7 to FIG. 9, the system 10 further comprises a firstimage capture device 32 (i.e. a first camera) and a second image capturedevice 34 (i.e. a second camera). Each of the first image capture device32 and the second image capture device 34 is capable of receivingbrightfield illumination supplied by the brightfield illuminator 26 andthe darkfield illuminations supplied by each of the low angle darkfieldilluminator 28 and high angle darkfield illuminator 30. Brightfield anddarkfield illuminations received by or entering the first image capturedevice 32 is preferably focused onto a first image capture plane forcapture of corresponding images. Brightfield and darkfield illuminationsreceived by or entering the second image capture device 34 is preferablyfocused on a second image capture plane for capture of correspondingimages.

The first image capture device 32 and the second image capture device 34capture either monochromatic or color images. Preferably, the ability tocapture, using single or three chip color sensor, color images of thewafer 12 enhances at least one of accuracy and speed of defectdetection. For example, the ability to capture color images of thesemiconductor wafer 12 preferably helps to reduce false detection ofdefects on the semiconductor wafer 12, and correspondingly falserejection thereof.

The optical inspection head 14 further comprises a first tube lens 36for use with the first image capture device 32. In addition, the opticalinspection head 14 further comprises a second tube lens 38 for use withthe second image capture device 34. Each of the first tube lens 36 andthe second tube lens 38 preferably share common optical characteristicsand functions. Accordingly, the tube lenses 36 and 38 have been labeledthe first tube lens 36 and the second tube lens 38 solely for purposesof clarity. The optical inspection head 14 also comprises a number ofobjective lenses 40, for example four objective lenses 40. The objectivelenses 40 are collectively mounted on a rotatable mount 42 (as shown inFIG. 3), which is rotatable for positioning each of the number ofobjective lens 40 above an inspection position (not shown) orsemiconductor wafer 12 positioned for inspection. The objective lenses40 may be collectively referred to as an objective lens assembly.

Each of the number objective lenses 40 is used to achieve differentmagnification and they are parfocal. Each of the number of objectivelens 40 is preferably of a different predetermined magnification factor,for example five times, ten times, twenty times, and fifty times.Preferably, each of the number of objective lenses 40 has a correctedaberration in infinity. It will however be understood by a personskilled in the art that each of the number of objective lenses can bechanged or redesigned to achieve different magnification and performancethereof.

Each of the low angle darkfield illuminator 28 and the high angledarkfield illuminator 30 preferably comprises focusing means ormechanisms for directing or focusing the darkfield illuminationtherefrom towards the semiconductor wafer 12 positioned at theinspection position. The angle between the low angle darkfieldilluminator 28 and the horizontal plane of the wafer 12 and the anglebetween the high angle darkfield illuminator 30 and the horizontal planeof the wafer 12 are preferably determined and adjustable for enhancingaccuracy of defect detection. Preferably, each of the low angledarkfield illuminator 28 and the high angle darkfield illuminator 30 hasa fixed spatial position with reference to the inspection position.Alternatively, the position of each of the low angle darkfieldilluminator 28 and the high angle darkfield illuminator 30 is variablewith reference to the inspection position during normal operation of thesystem 10.

As described above, both the brightfield illumination and the darkfieldilluminations are focused at the inspection position. The brightfieldillumination and the darkfield illuminations focused at the inspectionposition illuminates the semiconductor wafer 12, or the portion thereof,positioned at the inspection position.

As shown in FIG. 6, the system 10 comprises a wafer stack 20 or filmframe cassette holder. The wafer stack 20 preferably comprises slots tohold multiple semiconductor wafers. Each of the semiconductor multiplewafers are sequentially loaded or transferred onto the wafer table 16(as shown in FIG. 4) or wafer chuck by the robotic wafer handler 18 (asshown in FIG. 5). Preferably, a suction or vacuum is applied to thewafer table 16 for securing the semiconductor wafer 12 thereonto. Thewafer table 16 preferably comprises a predetermined number of smallholes or apertures through which vacuum is applied to enables a reliableand flat position of a flex frame tape and a frame (both not shown) ontothe wafer table 16. The wafer table 16 is also preferably designed tohandle wafer sizes of a range between and including six and twelveinches in diameter.

The wafer table 16 is coupled to the XY-displacement table 22 (as shownin FIG. 1 and FIG. 2), which enables the displacement of the wafer table16 in an X- and a Y-direction. Displacement of the wafer table 16correspondingly displaces the semiconductor wafer 12 placed thereon.Preferably, the displacement of the wafer table 16, and hencedisplacement of the semiconductor wafer 12 placed thereon, is controlledfor controlling the positioning of the semiconductor wafer 12 at theinspection position. The XY-displacement table 22 is alternatively knownas an air-gap linear positioner. The XY-displacement table 22 or air-gaplinear positioner facilitates high precision displacement of the wafertable 16 in the X- and Y-directions with minimal effect of vibrationtransmitted from the rest of the system 10 to the wafer table 16 andensures smooth and accurate positioning of the semiconductor wafer 12,or a portion thereof, at the inspection position. Assembly of theXY-displacement table 22 and wafer table 16 is mounted on the dampenersor vibration isolators 24 (as shown in FIG. 2) to absorb shocks orvibrations, and to ensure flatness of the assembly and other modules oraccessories mounted thereon. It will be appreciated by a person skilledin the art that alternative mechanisms or devices may be coupled to orused with the wafer table 16 controlling the displacement thereof, andfor facilitating high precision fine positioning of the wafersemiconductor 12 at the inspection position.

The inspection of the semiconductor wafer 12 for detecting possibledefects thereon is performed while the semiconductor wafer 12 is inmotion. This is to say, the capture of images, for example brightfieldimages and darkfield images, of the semiconductor wafer 12 preferablyoccurs as the semiconductor wafer 12 is being displaced across theinspection position. Alternatively, every new semiconductor wafer 12 maybe stopped under the imaging means to capture high-resolution images, ifthe user so chooses by programming the wafer table 16 (i.e. by softwarecontrol of the wafer table 16).

As previously mentioned, the system 10 further comprises the first tubelens 36 and the second tube lens 38. Preferably, the tube lens 36 ispositioned between the objective lenses 40 and the first image capturedevice 32. Illumination passes through the first tube lens 36 beforeentering the first image capture device 32. Further preferably, thesecond tube lens 38 is positioned between the objective lenses 40 andthe second image capture device 34. Illumination passes through thesecond tube lens 38 and deflected by a mirror or prism 47 beforeentering the second image capture device 34.

Each of the number of objective lenses 40 has a corrected aberration ininfinity. Accordingly, after passing through the objective lens 40,illumination or light is collimated. This is to say, illuminationtraveling between the objective lens 40 and each of the first tube lens36 and second tube lens 38 is collimated. The collimation ofillumination between the objective lens 40 and each of the first tubelens 36 and the second tube lens 38 enhances ease and flexibility ofpositioning of each of the first image capture device 32 and the secondimage capture device 34 respectively. The implementation of the tubelenses 36, 38 also eliminates the need to refocus illuminations enteringeach of the first image capture device 32 and the second image capturedevice 34 when different objective lenses 40 are used (for example whendifferent magnification factors are required). In addition, thecollimation of illumination increases ease of introduction andpositioning of additional optical components or accessories into thesystem 10, particularly between the objective lens 40 and each of thefirst tube lens 36 and the second tube lens 38. Further preferably, thecollimation of illumination enables in-situ introduction and positioningof additional optical components or accessories into the system 10,particularly between the objective lens 40 and each of the first tubelens 36 and the second tube lens 38, without a need for reconfiguringthe rest of the system 10. In addition, this arrangement helps toachieve longer working distance between objective lens 40 and thesemiconductor wafer 12, compared to that of used in existing equipments.Longer working distances between the objective lens 40 and the wafer isnecessary to use darkfield illuminations effectively.

It will therefore be appreciated by a person skilled in the art that thesystem 10 of the present invention allows for flexible and in-situdesign and reconfiguration of components of the system 10. The system 10of the present invention enhances ease of introduction and removal ofoptical components or accessories into and out of the system 10.

The first tube lens 36 facilitates focusing of collimated illuminationonto the first image capture plane. Similarly, the second tube lens 38facilitates focusing of collimated illumination onto the second imagecapture plane. Although, tube lenses are described for use with thesystem 10 in the present description, it will be appreciated by a personskilled in the art that alternative optical devices or mechanisms may beused for enabling collimation of illumination, more specifically thebrighfield illumination and darkfield illuminations, and the subsequentfocusing thereof onto either of the first image capture plane and thesecond image capture plane respectively.

The first image capture device 32 and the second image capture device 34are preferably positioned along adjacent parallel axes. Preferably, thespatial positions of the first image capture device 32 and the secondimage capture device 34 are determined for reducing space occupied bythe first image capture device 32 and the second image capture device 34such that the system 10 occupies a smaller total area (i.e. isspace-efficient).

Preferably, the system 10 further comprises a number of beam splittersand mirrors or reflective surfaces. The beam splitters and mirrors orreflective surfaces are preferably positioned for directing thebrightfield illumination and the darkfield illuminations from each ofthe low angle darkfield illuminator 28 and high angle darkfieldilluminator 30.

Preferably, the system 10 further comprises a central processing unit(CPU) with a storage memory or database (also known as a post processor)(not shown). The CPU is preferably electrically communicatable with orcoupled to the other components of the system 10, for example the firstimage capture device 32 and the second image capture device 34. Imagescaptured by the first image capture device 32 and the second imagecapture device 34 are preferably converted into image signals andtransmitted to the CPU.

The CPU is programmable for processing information, more specificallythe images, transmitted thereto to thereby detect defects present on thesemiconductor wafer 12. Preferably, the detection of defects on thesemiconductor wafer 12 is performed automatically by the system 10, andmore specifically by the CPU. Further preferably, the inspection ofsemiconductor wafers 12 by the system 10 is automatic, and controlled bythe CPU. Alternatively, the inspection of semiconductor wafers 12 forthe detection of defects is facilitated by at least one manual input.

The CPU is programmable for storing information transmitted thereto in adatabase. In addition, the CPU is programmable for classifying detecteddefects. In addition, the CPU is preferably programmed for storingprocessed information, more specifically the processed images anddefects detected, in the database. Further details regarding capture ofimages, processing of captured images, and detection of defects on thesemiconductor wafers 12 are provided below.

It will be appreciated by a person skilled in the art, using thedescription provided above, that the brightfield illumination emittedfrom or supplied by the brightfield illuminator 26 and the darkfieldilluminations emitted from each of the low angle darkfield illuminator28 and the high angle darkfield illuminator 30 (hereinafter referred toas darkfield low angle or DLA illumination and darkfield high angle orDHA illumination respectively) each follows a different ray path oroptical path.

A flowchart of an exemplary first ray path 100 followed by thebrightfield illumination is shown in FIG. 10.

In a step 102 of the first ray path 100, brightfield illumination orlight is supplied by the brightfield illuminator 26. As previouslymentioned, the brightfield illumination is preferably emitted from thefirst optical fiber of the brightfield illuminator 26. Preferably, thefirst optical fiber directs the brightfield illumination emitted fromthe brightfield illuminator 26. The brightfield illumination preferablypasses through a condenser 44. The condenser 44 concentrates thebrightfield illumination.

In a step 104, the brightfield illumination is reflected by a firstreflecting surface or a first mirror. Brightfield illumination reflectedby the first reflecting surface is directed towards a first beamsplitter 48.

The first beam splitter 48 reflects at least a portion of thebrightfield illumination striking thereonto in a step 106. Preferably,the first beam splitter 48 has a reflection/transmission (R/T) ratio of30:70. It will however be understood by a person skilled in the art thatthe R/T ratio of the first beam splitter 48 can be adjusted as requiredfor controlling the intensity or amount of brightfield illuminationreflected or transmitted thereby.

The brightfield illumination reflected by the first beam splitter 48 isdirected towards the inspection position. More specifically, thebrightfield illumination reflected by the first beam splitter 48 isdirected towards the objective lens 40 positioned directly above theinspection position. In a step 108, the brightfield illuminator 26 isfocused by the objective lens 40, at the inspection position or thesemiconductor wafer 12 positioned at the inspection position.

Brightfield illumination supplied by the brightfield illuminator 26, andfocused at the inspection position, illuminates the semiconductor wafer12, more specifically the portion of the semiconductor wafer 12,positioned at the inspection position. In a step 110, the brightfieldillumination is reflected by the semiconductor wafer 12 positioned atthe inspection position.

Brightfield illumination reflected by the semiconductor wafer 12 passesthrough the objective lens 40 in a step 112. As previously mentioned,the objective lens 40 has a corrected aberration in infinity. Therefore,brightfield illumination passing through the objective lens 40 iscollimated by the objective lens 40. The degree of magnification of thebrightfield illumination by the magnifying lens is dependent on themagnification factor of the objective lens 40.

Brightfield illumination passing through the objective lens 40 isdirected towards the first beam splitter 48. In a step 114, thebrightfield illumination strikes the first beam splitter 48 and aportion of thereof is transmitted through the first beam splitter 48.Extent of the brightfield illumination transmitted through the firstbeam splitter 48 in the step 114 depends on the R/T ratio of the firstbeam splitter 48. Brightfield illumination transmitted through the firstbeam splitter 48 travels towards a second beam splitter 50.

The second beam splitter 50 of the system 10 is preferably a cubic beamsplitter 50 having a predetermined R/T ratio. Preferably the R/T ratiois 50/50. The R/T ratio may be varied as required. The cubic beamsplitter 50 is preferred because the cubic bean splitter 50 splitsillumination received thereby into two optical paths. It will thereforebe appreciated by a person skilled in the art that the configuration andshape of the cubic beam splitter 50 will provide better performance andalignment for this purpose. Extent of illumination reflected ortransmitted by the second beam splitter 50 is dependent on the R/T ratioof the second beam splitter 50. In a step 116, the brightfieldillumination strikes the second beam splitter 50. The brightfieldillumination striking the beam splitter is either transmittedtherethrough or reflected thereby.

Brightfield illumination transmitted through the second beam splitter 50travels towards the first image capture device 32. The brightfieldillumination passes through the first tube lens 36 in a step 118 beforeentering the first image capture device 32 in a step 120.

The first tube lens 36 helps to focus the collimated brightfieldillumination onto the first image capture plane of the first imagecapture device 32. Brightfield illumination focused onto the first imagecapture plane enables capture of a brightfield image by the first imagecapture device 32.

The brightfield image captured by the first image capture plane ispreferably converted into image signals. The image signals aresubsequently transmitted or downloaded to the CPU. The transmission ofimage signals to the CPU is also known as data transfer. Transferredbrightfield images are then at least one of processed by and stored inthe CPU.

Brightfield illumination reflected by the second beam splitter 50travels towards the second image capture device 34. The brightfieldillumination passes through the second tube lens 38 in a step 122 beforeentering the second image capture device 34 in a step 124. The secondtube lens 38 helps to focus the collimated brightfield illumination ontothe second image capture plane. Brightfield illumination focused ontothe second image capture plane enables capture of a brightfield image bythe second image capture device 34.

The brightfield image captured by the second image capture plane ispreferably converted into image signals. The image signals aresubsequently transmitted or downloaded to the CPU. The transmission ofimage signals to the programmable controller is also known as datatransfer. Transferred brightfield images are then at least one ofprocessed by and stored in the CPU.

A flowchart of an exemplary second ray path 200 followed by thedarkfield high angle (DHA) illumination is shown in FIG. 11.

In a step 202 of the second ray path 200, DHA illumination is suppliedby the high angle darkfield illuminator 30. As previously mentioned, thesecond optical fiber preferably helps to direct the DHA illuminationsupplied from the high angle darkfield illuminator 30. Preferably, theDHA illumination is directly focused at the inspection position withouta need to pass through optical components or accessories, for examplethe objective lens 40.

In a step 204, DHA illumination directed at the inspection position isreflected by the semiconductor wafer 12, or the portion thereof,positioned at the inspection position. Reflected DHA illumination fromthe wafer passes through the objective lens 40 in a step 206. Theobjective lens 40, which has a corrected aberration in infinity,collimates the DHA illumination passing therethrough in the step 206.

DHA illumination passing through the objective lens 40 is directedtowards the first beam splitter 48. In a step 208, the DHA illuminationstrikes the first beam splitter 48 and a portion thereof is transmittedthrough the first beam splitter 48. The extent of transmission of theDHA illumination through the first beam splitter 48 is dependent on theR/T ratio of the first beam splitter 48.

DHA illumination transmitted through the first beam splitter 48 isdirected towards the second beam splitter 50. In a step 210, the DHAillumination strikes the second beam splitter 50. Transmission orreflection of the DHA illumination striking the second beam splitter 50is dependent on the R/T ratio of the second beam splitter 50.

DHA illumination transmitted through the second beam splitter 50 passesthrough the first tube lens 36 in a step 212 before entering the firstimage capture device 32 in a step 214. The first tube lens 36 helps tofocus the collimated DHA illumination onto the first image capture planeof the first image capture device 32. DHA illumination focused onto thefirst image capture plane enables capture of a darkfield image, morespecifically a darkfield high angle (DHA) image by the first imagecapture device 32.

Alternatively, DHA illumination is reflected by the second beam splitter50. Reflected DHA illumination, from the second beam splitter 50, passesthrough the second tube lens 38 in a step 216 before entering the secondimage capture device 34 in a step 218. The second tube lens 38 helps tofocus the collimated DHA illumination onto the second image captureplane of the second image capture device 34. DHA illumination focusedonto the second image capture place enables capture of a darkfieldimage, more specifically a darkfield high angle (DHA) image by thesecond image capture device 34.

A flowchart of an exemplary third ray path 250 followed by the darkfieldlow angle (DLA) illumination is shown in FIG. 12

In a step 252 of the third ray path 200, DLA illumination is supplied bythe low angle darkfield illuminator 28. The third optical fiberpreferably helps to direct the DLA illumination supplied by the lowangle darkfield illuminator 28. Preferably, the DLA illumination isdirectly focused at the inspection position without a need to passthrough optical components or accessories, for example the objectivelens 40.

In a step 254, DLA illumination directed at the inspection position isreflected by the semiconductor wafer 12, or the portion thereof,positioned at the inspection position. Reflected DLA illumination fromthe wafer passes through the objective lens 40 in a step 256. Theobjective lens 40, which has a corrected aberration in infinity,collimates the DLA illumination passing therethrough in the step 256.

DLA illumination passing through the objective lens 40 is directedtowards the first beam splitter 48. In a step 258, the DLA illuminationstrikes the first beam splitter 48 and a portion thereof is transmittedthrough the first beam splitter 48. The extent of transmission of theDLA illumination through the first beam splitter 48 is dependent on theR/T ratio of the first beam splitter 48.

DLA illumination transmitted through the first beam splitter 48 isdirected towards the second beam splitter 50. In a step 260, the DLAillumination strikes the second beam splitter 50. Transmission orreflection of the DLA illumination striking the second beam splitter 50is dependent on the R/T ratio of the second beam splitter 50.

DLA illumination transmitted through the second beam splitter 50 passesthrough the first tube lens 36 in a step 262 before entering the firstimage capture device 32 in a step 264. The first tube lens 36 helps tofocus the collimated DLA illumination onto the first image capture planeof the first image capture device 32. DLA illumination focused onto thefirst image capture plane enables capture of a darkfield image, morespecifically a darkfield high angle (DLA) image by the first imagecapture device 32.

Alternatively, DLA illumination is reflected by the second beam splitter50. Reflected DLA illumination from the second beam splitter 50, passesthrough the second tube lens 38 in a step 266 before entering the secondimage capture device 34 in a step 268. The second tube lens 38 helps tofocus the collimated DLA illumination onto the second image captureplane of the second image capture device 34. DLA illumination focusedonto the second image capture place enables capture of a darkfieldimage, more specifically a darkfield high angle (DLA) image by thesecond image capture device 34.

It will be appreciated by a person skilled in the art from thedescription provided above that the DHA illumination and DLAillumination preferably follows a similar ray path after being reflectedby the semiconductor wafer 12. However, the second ray path 200 of theDHA illumination and the third ray path 250 of the DLA illumination canbe individually altered as required using techniques known in the art.In addition, the angles at which the DHA illumination and the DLAillumination strike at semiconductor wafer 12 positioned at theinspection position may be adjusted as required for enhancing accuracyof defect detection. For example, the angles at which the DHAillumination and the DLA illumination strike at semiconductor wafer 12positioned at the inspection position may be adjusted depending on typeof semiconductor wafer 12 positioned at the inspection position or typeof wafer defect that a user of the system 10 wishes to detect.

The DHA images and the DLA images capture by each of the first imagecapture device 32 and the second image capture device 34 is preferablyconverted into image signal, which are subsequently transmitted ordownloaded to the CPU. The transmission of image signals to CPU is alsoknown as data transfer. Transferred DHA images and DLA images can thenbe at least one of processed by and stored in the CPU as required.

As previously mentioned, the first image capture device 32 and thesecond image capture device 34 have predetermined spatial positionsrelative each other. The use of the objective lens 40 together with thefirst tube lens 36 and the second tube lens 38 facilitates the spatialpositioning of the first image capture device 32 and the second imagecapture device 34. It will further be appreciated by a person skilled inthe art that other optical components or accessories, for examplemirrors, may be used for directing the brightfield illumination, DHAillumination and DLA illumination, and for facilitating the spatialpositioning of the first image capture device 32 and the second imagecapture device 34. Preferably, the spatial positions of the first imagecapture device 32 and the second image capture device 34 are fixed withreference to the inspection position. The fixed spatial positions of thefirst image capture device 32 and the second image capture device 34preferably enhances at least one of the accuracy and the efficiency ofwafer inspection by the system 10. For example, the fixed spatialpositions of the first image capture device 32 and the second imagecapture device 34 with respect to the inspection position preferablyreduces calibration losses and adjustment feedback losses typicallyassociated with the use of mobile image capture devices or cameras.

The optical inspection head 14 of the system 10 preferably furthercomprises a third illuminator (hereinafter referred to as a thin lineilluminator 52). The thin line illuminator can also be referred to as athin line illumination emitter. The thin line illuminator 52 emits orsupplies thin line illumination. The thin line illuminator 52 ispreferably a laser source for supplying thin line laser illumination.Alternatively, the thin line illuminator 52 is a broadband illuminatorsupplying a broadband thin line illumination. The thin line illuminationis preferably directed at the inspection position, more specifically atthe semiconductor wafer 12 positioned at the inspection position, at apredetermined angle, which can be varied as required. A mirror setup 54or mirror is preferably coupled to, or positioned at a predeterminedposition relative to, the thin line illuminator 52 for directing thethin line illumination at the inspection position.

The optical inspection head 14 of the system 10 preferably comprises athird image capture device (hereinafter referred to as athree-dimensional (3D) profile camera 56). Preferably, the 3D profilecamera 56 receives the thin line illumination reflected by thesemiconductor wafer 12. Preferably, the thin line illumination enteringthe 3D profile camera 56 is focused onto a 3D image capture plane (notshown) to thereby capture 3D images of the semiconductor wafer 12. The3D optical setup comprising the thin line illuminator 52 and the 3Dprofile camera 56 is shown in FIG. 13.

The optical inspection head 14 further comprises an objective lens forthe 3D profile camera 56 (hereinafter referred to as a 3D profileobjective lens 58). The thin line illumination reflected by thesemiconductor wafer 12 passes through the 3D profile objective lens 58before entering the 3D profile camera 56. Preferably, the 3D profileobjective lens 58 has a corrected aberration in infinity. Accordingly,the thin line illumination passing through the 3D profile objective lens58 is collimated thereby. The optical inspection head 14 furthercomprises a tube lens 60 for use with the 3D profile objective lens 58and the 3D profile camera 56. The tube lens 60 enables focusing of thecollimated thin line illumination onto the 3D image capture plane. Theuse of the tube lens 60 with the 3D profile objective lens 58 and the 3Dprofile camera 56 facilitates flexible positioning and reconfigurationof the 3D profile camera 56. In addition, the use of the tube lens 60with the 3D profile objective lens 58 and the 3D profile camera 56enables ease of introducing additional optical components or accessoriesbetween the 3D profile objective lens 58 and the tube lens 60.

The thin line illuminator 52 and the 3D profile camera 56 preferablyoperate cooperatively for facilitating 3D profile scanning andinspection of the semiconductor wafer 12. Preferably, the thin lineilluminator 52 and the 3D profile camera 56 are coupled to the CPU,which helps to coordinate or synchronize the operation of the thin lineilluminator 52 and the 3D profile camera 56. Further preferably, anautomated 3D profile scanning and inspection of the semiconductor wafer12 is performed by the system 10. This automated 3D profile scanning andinspection of the semiconductor wafer 12 is preferably controlled by theCPU.

In addition, the optical inspection head 14 comprises a review imagecapture device 60. The review image capture device 60 is for example acolor camera. The review image capture device 60 preferably capturescolor images. Alternatively, the review image capture device 60 capturesmonochromatic images. The review image capture device 60 preferablycaptures review images of the semiconductor wafer 12 for at least one ofconfirming, classifying and reviewing defect detected on thesemiconductor wafer 12.

The optical inspection head 14 further comprises a review brightfieldilluminator 62 and a review darkfield illuminator 64 for supplyingbrightfield illumination and darkfield illumination respectively. Thereview image capture device 60 receives the brightfield illumination andthe darkfield illumination supplied by the review brightfieldilluminator 62 and the review darkfield illuminator 64 respectively, andreflected by the semiconductor wafer 12, for capturing review images ofthe semiconductor wafer 12. Alternatively, the review image capturedevice 60 captures illumination supplied by alternative illuminators,for example one of that described above, for capturing review images ofthe semiconductor wafer 12. The review image capture device 60preferably captures high-resolution images of the semiconductor wafer12.

A diagram of showing the review brightfield illuminator 62, the reviewdarkfield illuminator 64, the review image capture device 60 andillumination patterns therebetween, is provided in FIG. 14. A flowchartof an exemplary fourth ray path 300 followed by the brightfieldillumination supplied by the review brightfield illuminator 62 is shownin FIG. 15.

In a step 302 of the fourth ray path 300, brightfield illumination issupplied by the review brightfield illuminator 62. The brightfieldillumination supplied by the review brightfield illuminator 62 isdirected at a first reflective surface 66. In a step 304, thebrightfield illumination is reflected by the first reflective surface 66and directed towards a beam splitter 68. In a subsequent step 306, thebrightfield illumination striking the beam splitter 68 is reflectedthereby and directed towards the inspection position. Extent ofbrightfield illumination reflected by the beam splitter 68 depends onR/T ratio thereof.

In a step 308, the brightfield illumination is reflected by thesemiconductor wafer 12, or portion thereof, positioned at the inspectionposition. The reflected brightfield illumination passes through a reviewobjective lens 70 in a step 310. Preferably, the review objective lens70 has a corrected aberration in infinity. Accordingly, the brightfieldillumination passing through the review objective lens 70 in the step310 is collimated by the review objective lens 70.

In a step 312, the brightfield illumination strikes the beam splitter 68and a portion thereof is transmitted therethrough. Extent of thebrightfield illumination passing through the beam splitter 68 isdepending on the R/T ratio of the beam splitter 68. The brightfieldillumination then passes through a review tube lens 72 in a step 314before entering the review image capture device 60 in a step 316. Thereview tube lens 72 focuses the collimated brightfield illumination ontoan image capture plane of the review image capture device 60.Brightfield illumination focused on the image capture plane of thereview image capture device 60 facilitates capture of review brightfieldimages in a step 318.

The collimation of the brightfield illumination between the reviewobjective lens 70 and the review tube lens 72 preferably facilitatesease of introduction of optical components and accessories therebetween.In addition, the collimation of the brightfield illumination between thereview objective lens 70 and the review tube lens 72 preferably enablesflexible positioning and reconfiguration as required of the review imagecapture device 60.

A flowchart of an exemplary fifth ray path 350 followed by the darkfieldillumination supplied by the review darkfield illuminator 64 is shown inFIG. 16.

In a step 352 of the fifth ray path 350, darkfield illumination issupplied by the review darkfield illuminator 64. The darkfieldillumination supplied by the review darkfield illuminator 64 ispreferably directly focused at the inspection position. In addition, thedarkfield illumination supplied by the review darkfield illuminator 64is preferably directed at the inspection position at a predeterminedangle to a horizontal plane of the semiconductor wafer 12. Thispredetermined angle is preferably a high angle, and can be adjusted asrequired using techniques known to a person skilled in the art.

In a step 354, the darkfield illumination is reflected by thesemiconductor wafer 12, or portion thereof, positioned at the inspectionposition. The reflected darkfield illumination then passes through thereview objective lens 70 in a step 356. The darkfield illuminationpassing through the review objective lens 70 in the step 356 iscollimated by the review objective lens 70.

In a step 358, the collimated darkfield illumination strikes the beamsplitter and a portion thereof is transmitted therethrough. Extent ofthe darkfield illumination passing through the beam splitter 68 isdepending on the R/T ratio of the beam splitter 68. The darkfieldillumination then passes through the review tube lens 72 in a step 360before entering the review image capture device 60 in a step 362. Thefourth tube lens 72 focuses the collimated darkfield illumination ontoan image capture plane of the review image capture device 60. Darkfieldillumination focused on the image capture plane of the review imagecapture device 60 facilitates capture of review darkfield images in astep 364. The collimation of each of the brightfield illumination anddarkfield illumination between the review objective lens 70 and thereview tube lens 72 enhances ease of design and configuration of thesystem 10. More specifically, the collimation of each of the brightfieldillumination and darkfield illumination between the review objectivelens 70 and the review tube lens 72 enhances ease of positioning orconfiguration of the review image capture device 60 with the othercomponents of the system 10, thereby facilitating capture, while thesemiconductor wafer 12 is in motion, of the review brightfield imagesand review darkfield images.

Captured review brightfield images and captured review darkfield imagesare preferably converted into image signals and transmitted from thereview image capture device 60 to the programmable controller where theycan be processed, and stored or saved in the database.

The review image capture device 60 can have a fixed spatial positionrelative the inspection position. The fixed spatial position of thereview image capture device 60 preferably reduces calibration losses andadjustment feedback losses typically associated with the use of mobileimage capture devices or cameras, (Note: The preceding statement is tohighlight advantage of fixed position of review image capture device,made possible by use of tube lens) thereby enhancing quality of reviewbrightfield images and review darkfield images captured.

The system 10 further comprises vibration isolators 24, which arecollectively known as a stabilizer mechanism. The system 10 ispreferably mounted on the vibration isolators 24 or stabilizer mechanismwhen the system is in normal operation. Preferably the system 10comprises four vibration isolators 24, each positioned at a differentcorner of the system 10. The vibration isolators 24 help to support andstabilize the system 10. Each vibration isolator 24 is preferably acompressible structure or canister, which absorbs ground vibrations tothereby serve as a buffer for preventing transmission of groundvibrations to the system 10. By preventing unwanted vibrations orphysical movements to the system 10, the vibration isolators 24 help toenhance quality of images captured by each of the first image capturedevice 32, the second image capture device 34, the 3D profile camera 56and the review camera 60, and to thereby improve quality of inspectionof the semiconductor wafer 12.

An exemplary method 400 for inspecting the semiconductor wafer 12 isprovided according to an embodiment of the present invention. A methodflow diagram of the exemplary method 400 is shown in FIG. 17. The method400 for inspecting the semiconductor wafer 12 enables at least one ofdetection, classification and review of defects on the semiconductorwafer 12.

The exemplary method 400 for inspecting semiconductor wafers 12 utilizesreference images (also known as golden references) to which capturedimages of the semiconductor wafers 12 are compared for at least one ofdetecting, classifying and review of defects on the semiconductor wafers12. For purposes of clarity, description of an exemplary reference imagecreation process 900 is provided before the description of the exemplarymethod 400. The exemplary reference image creation process 900 is shownin FIG. 18.

Exemplary Reference Image Creation Process 900

In a step 902 of the reference image creation process 900, a recipecomprising a predetermined number of reference regions on thesemiconductor wafer 12 is loaded. The recipe is preferably created orderived by a computer software program. Alternatively, the recipe ismanually created. The recipe can be stored in the database of the CPU.Alternatively, the recipe is stored in an external database or memoryspace.

Each of the predetermined reference regions represents locations on thesemiconductor wafer 12, which is of an unknown quality. The use ofmultiple reference regions helps to compensate for possibility ofsurface variations at different locations on the semiconductor wafer 12,or between multiple wafers. Such surface variations include, but are notlimited to, differential planarity and illumination reflectivity. Itwill be understood by a person skilled in the art that the predeterminednumber of reference regions may represent an entire surface area of thesemiconductor wafer 12. Alternatively, the predetermined number ofreference regions may represent multiple predetermined locations onmultiple wafers.

In a step 904, a first reference region is selected. In a subsequentstep 906, a predetermined number (“n”) of images are captured of thefirst capture position of the selected reference region. Morespecifically, the n images are captured at each predetermined locationsof the selected reference region. Number and location of thepredetermined locations of the selected reference region can be variedas required and facilitated by at least one of software program andmanual input.

The n images can be captured using at least one of the first imagecapture device 32, the second image capture device 34 and the reviewimage capture device 62 as required. Alternatively, the n images arecaptured using a different image capture device. Illuminations used forcapture of the n images can be varied as required, and are for exampleone or combination of the brightfield illumination, the DHA illuminationand the DLA illumination. Colors and intensities of the illuminationsused for capture of the n images can be selected, and varied, asrequired.

Capture of multiple images at each position preferably enables referenceimages to be created taking into account the variations in theillumination, optical setup and the imaging means used during capture ofthe reference images. This method of reference image creation minimizesunwanted influences or effects on defect detection, and classification,due to variations between the illumination conditions. In addition, anumber of images of the selected reference region may be captured foreach specified illumination condition. Preferably, capture of multipleimages at each specified illumination condition facilitates anormalizing or compensation of illumination variation from flash toflash or from strobe to strobe.

The n images are preferably stored in the database of the CPU.Alternatively, the n images are stored in an external database or memoryspace as required. In a step 908, the n images captured in the step 906are aligned and preprocessed. Preferably, subpixels of the n imagescaptured in the step 906 are registered. Registration of the subpixelsof the n images is preferably performed using known referencesincluding, but not limited to, traces, bumps or pads formed on the oneor more wafer using one or more of binary, grey scale or geometricalpattern matching.

In a step 910, reference intensities of each of the n images arecalculated. More specifically, reference intensity of each imagecaptured at each of the predetermined locations of the selectedreference region is calculated. Preferably, the calculation of referenceintensities of each of the n images helps to normalize or compensate forcolor variation at different locations or regions on the semiconductorwafer 12 (or the multiple wafers). Further preferably, the calculationof reference intensities of each of the n images helps to account, orcompensate, for other surface variations at different locations orregions on the semiconductor wafer 12 (or the multiple wafers).

The step 910 results in calculated of n reference intensities, each ofthe n reference intensities corresponding to one of the n images. In astep 912, a number of statistical information of intensities each pixelof each of the n images are calculated. The number of statisticalinformation includes, but is not limited to, an average, a range, astandard deviation, a maximum and a minimum intensity for each pixel ofeach of the n images.

More specifically, the average is a geometric mean of the referenceintensity for each pixel of each of the n images. Geometric mean is atype of mean or average, which indicates the central tendency or typicalvalue of a set of numbers, or n numbers. The numbers of the set aremultiplied and then the nth root of the resulting product is obtained. Aformula for obtaining geometric mean is shown below:

$\left( {\prod\limits_{i = 1}^{n}\; a_{i}} \right)^{1/n} = \sqrt[n]{{a_{1} \cdot a_{2}}\mspace{14mu}\ldots\mspace{14mu} a_{n}}$

Calculation of the geometric mean instead of arithmetic mean or medianprevents the average intensity calculated for each pixel of each of then images from being unduly affected by extreme values in a data set.

In addition, range of absolute intensity (hereinafter referred to as Ri)for each pixel of the n images is calculated. Preferably, the Ri foreach pixel of the n images is the value between a maximum and a minimumabsolute intensity for each pixel of the n images.

As previously mentioned, the standard deviation of the intensity of eachpixel for each of the n images of the first reference region captured inthe step 906 is also calculated. More specifically, the standarddeviation is a geometric standard deviation, which describes how spreadout are a set of numbers whose preferred average is the geometric mean.A formula for obtaining the standard deviation is shown below:

$\sigma_{g} = {{\exp\left( \sqrt{\frac{\sum\limits_{i = 1}^{n}\left( {{\ln\; A_{i}} - {\ln\;\mu_{g}}} \right)^{2}}{n}} \right)}.}$where μ_(g), is the geomtric mean of a set of numbers {A₁, A₂, . . . ,A_(n)}.

In a step 914, the n images captured are temporarily saved, togetherwith their corresponding information such as location on thesemiconductor wafer 12 or first reference region. The statisticalinformation calculated in the step 912 is preferably also temporarilysaved in the step 914. Preferably, the above data is saved in thedatabase of the CPU. Alternatively, the above data is saved in analternative database or memory space as required.

In a step 916, it is determined if more images of the selected referenceregion are required. The step 916 is preferably software controlled andpreformed automatically. Preferably, the step 916 is performed with areliance on information obtained by the steps 910 and 912.Alternatively, the step 916 is manually facilitated or controlled usingtechniques known in the art.

If it is determined in the step 916 that more images of the selectedreference region are required, the steps 904 to 916 are repeated. Thesteps 904 to 916 can be repeated any number of times as required. Whenit is determined in the step 916 that no more images of the firstreference region is required, a step 918 of determining if the steps 904to 916 need to be repeated for a next reference region (for purposes ofthe present description, a second reference region) of the predeterminednumber of reference regions. The step 918 is preferably softwarecontrolled and performed automatically. In addition, the step 918 ispreferably performed using information obtained in at least one of steps910, 912 and 916. Alternatively, the step 918 is manually facilitated orcontrolled using techniques known in the art.

If it is determined in the step 918 that images of the second referenceregion need to be captured, i.e. if the steps 904 to 916 need to berepeated for the second reference region, a signal is generated forrepeating the steps 904 to 916. The steps 904 to 918 can be repeated anynumber of times as required. Repetition of the steps 904 to 918 ispreferably software controlled and automated.

When it is determined in the step 918 that the steps 904 to 918 do notneed to be repeated, i.e. that images of the next reference region ofthe predetermined number of reference regions are not required, goldenreference images (hereinafter referred to as reference images) are thencalculated in a step 920.

The calculation of the reference images is preferably softwarecontrolled, and is performed via a series of program instructions. Thefollowing steps are exemplary steps performed for calculating thereference images. It will however be understood by a person skilled inthe art that additional steps or techniques complementary to thefollowing steps may be performed in the calculation of the referenceimage.

In a step 922, pixels having reference intensities greater than apredefined limit is determined. In addition, pixels having range ofpixel intensities greater than a predefined range is determined in thestep 922. The predefined limit and range of the step 922 can be softwareselected and determined or manually determined. In a step 924, pixels ofintensities with a standard deviation greater than a predefined valueare identified. The predefined value of the step 924 can be softwareselected and determined or manually determined. In a step 926, thepreviously saved images, as in the step 914, are reloaded for repeat ofany one of more of the steps 904 to 924 if a pixel with referenceintensities outside predetermined value or range is identified duringthe steps 922 to 924.

The steps 922 to 926 facilitate identification of images comprisingpixels of specific pixel intensities. More specifically, the steps 922to 926 enable identification of images containing pixels havingreference intensities outside predefined limits or ranges, for exampleidentification of “undesirable” images, to be identified. Morespecifically, the steps 922 to 926 eliminate “undesirable” pixels fromthe reference image calculation and help to prevent “undesirable” pixelsinfluence on the final reference pixel values of the reference image.

The “undesirable” images are discarded. This facilitates elimination ofdefective data or images, thereby preventing influence or presence ofsuch defective data with generated reference images. In a step 928,images comprising pixels within predefined limits and ranges (i.e.images not discarded) are consolidated.

Preferably, the reference image creation process 900 results inderivation of the following image data:

-   -   (a) Normalized average of intensity of each pixel of each of the        consolidated images    -   (b) Standard deviation of intensity of each pixel of each of the        consolidated images    -   (c) Maximum and minimum intensities of each pixel of each of the        consolidated images    -   (d) Average reference intensity of each of the predetermined        number of reference regions determined in the step 702

The consolidated images of the step 928 represent reference images. Thereference images, together with corresponding image data is furthersaved in the step 928. The reference images and their correspondingimage data are preferably saved in the database of the CPU.Alternatively, the reference images and their corresponding image dataare saved in an alternative database or memory space. It will beappreciated by a person skilled in the art that the step 922 to 926helps to reduce amount or size of memory space required for storing thereference images and their corresponding data, which may enable themethod 400 to be performed at a higher speed or accuracy.

The average intensity of each pixel is preferably normalized to 255 inorder to display and visualize the reference images. It will however beunderstood by a person skilled in the art that the average intensity ofeach pixel can be normalized to an alternative value in order to displayand visualize the reference images.

The steps 904 to 928 can be repeated a predetermined number of times forcapturing a corresponding number of images with at least one of thefirst image capture device 32, the second image capture device 34 andthe review camera. In addition, the steps 904 to 928 can be repeated forcapturing images at different illuminations or illumination conditions,for example brightfield illumination, DHA illumination, DLA illuminationand thin line illumination, as required. The repetition of the steps 904to 928 enables creation of reference images for multiple illuminationsor illumination conditions, and with multiple image capture devices asrequired.

As previously described, the derivation of reference images for multiplereference regions of the semiconductor wafer 12 (or multiple wafer) andat multiple illumination conditions helps to ensure accountability, andcompensation where required, for variations in quality of subsequentlycaptured images due to variations in the lighting conditions. Forexample, the capture of reference images at different reference regionsof the semiconductor wafer 12 (i.e. different locations on thesemiconductor wafer 12) preferably ensures accountability andcompensation for color variations at different locations on thesemiconductor wafer 12.

The steps 904 to 928 are preferably executed and controlled by the CPU.Preferably, the steps 904 to 928 are at least one of executed andcontrolled by a software program.

Alternatively, at least one of the steps 904 to 928 may be manuallyassisted if required. The reference images created by the exemplaryreference image creation process 900 are used for comparison withsubsequently captured images of semiconductor wafers 12 of unknownquality to thereby enable at least one of detection, classification andreview of defects on the semiconductor wafer 12.

As previously mentioned, the present invention provides the exemplarymethod 400 for inspection of semiconductor wafers 12 to thereby at leastone of detect, classify and review defects present on the semiconductorwafers 12.

In a step 402 of the method 400, the semiconductor wafer 12 to beinspected by the system 10 is loaded onto the wafer table 16.Preferably, the semiconductor wafer 12 is extracted from the wafer stack20 by the robotic wafer handler 18 and transferred onto the wafer table16. Suction or vacuum is applied to the wafer table 16 to secure thesemiconductor wafer 12 thereonto.

The semiconductor wafer 12 preferably comprises a wafer identificationnumber (ID number) or barcode. The wafer ID number or barcode isengraved or tagged onto a surface of the semiconductor wafer 12, morespecifically at a periphery of the surface of the semiconductor wafer12. The wafer ID number or barcode helps to identify the semiconductorwafer 12 and ensures that the semiconductor wafer 12 is correctly orappropriately loaded onto the wafer table 16.

In a step 404, a wafer map of the semiconductor wafer 12 loaded onto thewafer table 16 is obtained. The wafer map may be loaded from thedatabase of the programmable controller. Alternatively, the wafer mapmay be retrieved from an external database or processor. Furtheralternatively, the wafer map may be prepared or derived upon the loadingof the semiconductor wafer 12 onto the movable support platform usingmethods or techniques known to a person skilled in the art.

In a step 406, one or more reference locations are captured ordetermined on the wafer map and at least one of wafer X, Y translationaland θ rotational offset is calculated using techniques known to a personskilled in the art.

In a subsequent step 408, a wafer scan motion path and a plurality ofimage capture positions are calculated or determined. The wafer mapobtained in the step 404 preferably facilitates the calculation of thewafer scan motion path and the plurality of image capture positions.Preferably, the calculation of the wafer scan motion path is dependenton at least one of several known parameters. Such known parametersinclude, but are not limited to, rotation offset, wafer size, wafer diesize, wafer pitch, inspection area, wafer scan velocity and encoderposition. Each of the plurality of image capture positions reflects orcorresponds to a position on the semiconductor wafer 12 of which imagesare to be captured. Preferably, each of the plurality of image capturepositions can be altered as required using techniques known to a personskilled in the art. The number of image capture positions can also bealtered as required using techniques known to a person skilled in theart.

Preferably, the steps 404 to 408 are performed automatically by thesystem 10, more specifically by the programmable controller of thesystem 10. Alternatively, any one of the steps 404 to 408 may beperformed by, or with the aid of, an alternative processor.

In a step 410, the programmable controller of the system 10 determinesavailability of an appropriate golden reference (hereinafter referred toas a reference image). If the reference image is not available, thereference image is created by the exemplary reference image creationprocess 900 as described above in a step 412.

Preferably, the reference image is obtained, or created, beforeperforming an exemplary two-dimensional (2D) wafer scanning process 400in a step 414. A process flow diagram of the exemplary two-dimensional(2D) wafer scanning process 500 is shown in FIG. 19.

Exemplary Two-Dimensional (2D) Wafer Scanning Process 500

The 2D wafer scanning process 500 enables capture of brightfield imagesand darkfield images by the first image capture device 32 and the secondimage capture device 34.

In a step 502 of 2D wafer scanning process 500, the first image capturedevice 32 is exposed. In a step 504, a first illumination is supplied.The first illumination is for example brightfield illumination suppliedby the brightfield illuminator 26, DHA illumination supplied by the highangle darkfield illuminator 30 or DLA illumination supplied by the lowangle darkfield illuminator 28. Selection of the first illumination tobe supplied in the step 504 is preferably determined by an illuminationconfigurator (not shown). Preferably, the illumination configurator is acomponent of the system 10 and electronically coupled to theilluminators (28, 30, 52, 64 and 66) of the system 10. Alternatively,the illumination configurator is a component of the CPU.

The image capture devices 32 and 34 can use any combination ofilluminations provided by brightfield illuminator 26, DHA illuminator 30and DLA illuminator 28. Few of the possible combinations for the firstillumination used by the image capture device 32 and the secondillumination used by the image capture device 34 are shown in the tableof FIG. 19. If the first image capture device 32 and the second imagecapture device 34 use substantially similar illumination then thethroughput of such configuration would be the highest of all theconfigurations possible.

For purposes of the present description, configuration 1 as shown in thetable of FIG. 20 is selected by the illumination configurator.Accordingly, the first illumination is the brightfield illuminationsupplied by the brightfield illuminator 26.

Preferably, the steps 502 and 504 are performed simultaneously.Performance of the steps 502 and 504 enables capture of a first image,as shown in FIG. 22a , by the first image capture device 32. In a step506, the first image captured by the first image capture device 32 isconverted into image signals and transmitted to the CPU via the datatransfer process and preferably stored in the database or storagememory.

In a step 508, the second image capture device 34 is exposed. In a step510, a second illumination is supplied. As with the first illumination,selection of the second illumination is preferably determined by theillumination configurator. For purposes of the present description,configuration 1 as shown in the table of FIG. 20 is selected by theillumination configurator. Accordingly, the second illumination is theDHA illumination supplied by the high angle darkfield illuminator 30. Itwill however be appreciated by a person skilled in the art that thefirst illumination and the second illuminations may be alternativeilluminations as required, for example those of the differentconfigurations shown in the table of FIG. 20.

Preferably, the steps 508 and 510 are performed simultaneously.Preferably, the step 506 occurs in tandem with the performance of thesteps 508 and 510. Performance of the steps 508 and 510 enables captureof a second image, as shown in FIG. 22b , by the second image capturedevice 34. In a step 512, the second image captured by the second imagecapture device 34 is converted into image signals and transmitted to theprogrammable controller via the data transfer process and preferablystored in the database or storage memory.

A diagram showing the exposure of the first image capture device 32,supply of the first illumination, exposure of the second image capturedevice 34, supply of the second illumination and the data transferprocesses is provided by FIG. 21. The steps 502 to 512 can be repeatedany number of times for capturing a corresponding number of sets offirst images and second images of the semiconductor wafer 12. Morespecifically, the steps 502 to 512 are preferably repeated for capturingimages with the first illumination and the second illumination of thesemiconductor wafer 12 at each of the plurality of image capturepositions along the wafer scan motion path as calculated in the step408.

As previously described, each of the first image and the second imageare converted into image signals and transmitted to the programmablecontroller and stored in the database or storage memory. Each of thesteps 502 to 512 is performed while the semiconductor wafer 12 is inmotion. This is to say, the capture of the first image and the secondimage is performed while the semiconductor wafer 12 is in motion alongthe wafer scan motion path. Accordingly, a person skilled in the artwill appreciate that the semiconductor wafer 12 will be displaced by apredetermined distance along the wafer scan motion path between thesteps 502, 504 (which preferably occur simultaneously) and the steps508, 510 (which preferably also occur simultaneously). The predetermineddistance depends on several factors including, but not limited to, speedof displacement of the semiconductor wafer 12 along the wafer scanmotion path and time required for any one of the steps 502 to 512. Thepredetermined distance may be controlled and varied as required, forexample by the CPU. The control and variation of the predetermineddistance may be at least one of software or manually facilitated.

Accordingly, the first image will have a predetermined image offset whensuperimposed onto or compared with the second image. FIG. 22c shows acombined image of the first image and the second image demonstratingresulting image offset due to the capture of the first image and thesecond image while the semiconductor wafer 12 is in motion. Thepredetermined image offset depends on several factors including, but notlimited to, speed of displacement of the semiconductor wafer 12 alongthe wafer scan motion path and time required for any one of the steps502 to 512. Control and variation of the predetermined image offset maybe at least one of software or manually facilitated.

In a step 514, XY encoder values are retrieved. The XY encoder valuesare preferably obtained at during each of the steps 504 and 510.Preferably, the XY encoder values represent positions (XY-displacement)of the semiconductor wafer 12 along the wafer scan motion path. The XYencoder values obtained are used for calculating the image offset(coarse offset) between the first image and the second image (i.e.relative offset of the second image from the first image) in a step 516.The fine image offset is calculated by performing sub pixel imagealignment using pattern matching techniques. The final offset isobtained by applying a predetermined mathematical formula on the coarseand fine image offsets. The predetermined mathematical formula may beadjusted as required using techniques known to a person skilled in theart.

The 2D wafer scanning process 500 performed in the step 414 of themethod 400 results in the capture of multiple images of thesemiconductor wafer 12, preferably at the calculated image capturepositions along the wafer scan motion path.

In a step 416 of the method 400, an exemplary two-dimensional (2D) imageprocessing process 600 is performed for at least one of identifying ordetecting, classifying, consolidating and storing defects on thesemiconductor wafer 12. A process flow diagram of the exemplary 2D imageprocessing process 600 is shown in FIG. 23.

Exemplary 2D Image Processing Process 600

The 2D image processing process 600 facilitates processing of the imagescaptured in the 2D wafer scanning process 500. In addition, the 2D imageprocessing process 600 facilitates at least one of identifying ordetecting, classifying, consolidating and storing defects on thesemiconductor wafer 12.

In a step 602 of 2D image processing process 600, a first working imageis selected and loaded in a memory workspace. The first working image isselected from the number of first images and second images captured andsaved during the 2D wafer scanning process. For purposes of the presentdescription, the first working image represents the first image capturedby the first image capture device 32 during the 2D wafer scanningprocess 500.

In a step 604, sub-pixel alignment of the first working image isperformed. Sub-pixel alignment is performed using pattern matchingtechniques using one or more templates. It is performed using one ofbinary or grey scale or geometrical pattern matching methods. Oncealigned, reference intensity for each image is calculated from one ormore predefined region of interests in the image as shown in a step 606.The steps 604 and 606 may be collectively referred to as a preprocessingof the first working image. It can be readily appreciated that thepreprocessing is not limited to above steps. Additional steps can beincorporated for the preprocessing if necessary.

In a subsequent step 608, a first golden reference or reference image isselected. The first reference image selected in the step 608 correspondsor matches with the first working image. Preferably, the first referenceimage is selected from a database or collection of golden references orreference images created by the exemplary reference creation process 900in the step 412 of the method 400. The exemplary reference creationprocess 900 is described in detail above, and shown in FIG. 18.

In a step 610, quantitative data values for each pixel of the firstworking image are calculated. In a step 612, the calculated quantitativedata values for each pixel of the first working image are referencedwith a predetermined threshold value together with multiplicative oradditive factors.

In a step 614, the first working image is then matched or evaluatedagainst the first reference image selected in the 608. The matching orevaluation of the first working image with the first reference imagefacilitates detection or identification of defects on the semiconductorwafer 12. Preferably, the CPU is programmed for effecting automatedmatching between the first working image and the first reference image.The programmable controller preferably carries out a series of computinginstructions or algorithms for matching the first working image with thefirst reference image to thereby enable the detection or identificationof defects on the semiconductor wafer 12.

Determination of presence of one or more defects occurs in a step 616 ofthe 2D image processing process 600. If more than one defects aredetected or identified in the step 616, the algorithm would sort thedefects from the largest to the shortest based on either one or all ofarea, length, width, contrast, compactness, fill factor, edge strengthamong others. Further the algorithm selects only those defects whichmeets user defined criteria to calculate defective region of interest(DROI). If a defect (or more than one defects) is detected or identifiedin the step 616, DROI on the semiconductor wafer 12 is then calculatedin a step 618. Preferably, the DROI is calculated dynamically by the CPUin the step 618. The CPU is preferably programmed (i.e. comprises orembodies a series of computing instructions or software) for enablingthe calculation of the DROI.

In a step 620, a corresponding DROI of a second working image isinspected. More specifically, the second working image is the secondimage captured by the second image capture device 34 during the 2D waferscanning process 400. This is to say, the DROI of the second image(which is a corresponding image of the first image), is inspected in thestep 620 after performing sub-pixel alignment of second working image.The inspection of the DROI of the second working image preferablyfacilitates confirmation of defect detected in the step 616. Furtherpreferably, the step 620 facilitates classification of defect detectedin the step 606.

The system 10 processes the DROIs of the second working image instead ofthe entire image. In addition, in the step 616, if there is no defectfound, the method would skip the steps 618 onwards. This will furtherreduce the amount resources or processing band width needed forprocessing the second working image. It can be readily appreciated thatsuch intelligent processing sequence dynamically decides based on theresults of preceding steps. This will facilitate improved system 10throughput or wafers per hour.

In a step 622, the detected defect, more specifically the location orposition of defect as well as the classification thereof, is saved.Preferably, the detected defect, and the location and classificationthereof, is saved in the database of the CPU. Alternatively, thedetected defect, and the location and classification thereof, is savedin an alternative database or memory space.

The steps 602 to 622 can be repeated or looped any number of times forprocessing the images captured during the 2D wafer scanning process 500.Each of the images captured during the 2D wafer scanning process 500 issequentially loaded in the memory workspace and processed forfacilitating the detection of defects, which may be present on thesemiconductor wafer 12. The steps 602 to 622, and the repetitionthereof, facilitates at least one of detection, confirmation, andclassification of defects, which may be present on the semiconductorwafer 12 at any of the multiple image capture positions along the waferscan motion path.

In a step 624, each of multiple defects, and the locations andclassifications thereof, detected by the 2D image processing process 600are consolidated and saved, preferably in the database of the CPU.Alternatively the defects, and the locations and classificationsthereof, are consolidated and saved in an alternative database or memoryspace.

The 2D image processing process is preferably an automated process.Preferably, the CPU is programmed for, or comprises a series ofcomputing instructions or software program, for automatically performingthe 2D image processing process. Alternatively, the 2D image processingprocess may be facilitated by an at least one manual input as required.

Completion of the 2D image processing process 600 of the step 416 of themethod 400 results in consolidation and storage of defects, and thelocations and classifications thereof, detected using the brightfieldillumination, the DHA illumination and DLA illumination.

In a subsequent step 418 of the method 400, a first exemplarythree-dimensional (3D) wafer scanning process 700 is performed.Preferably, the first 3D wafer scanning process 700 enables capture of3D profile images of the semiconductor wafer 12, for facilitatingconsequent formation of a 3D profile of the semiconductor wafer 12. Thesemiconductor wafer 12 is displaced along the calculated wafer scanmotion path for capturing 3D images of the semiconductor wafer 12 at anyone or more of the multiple images capture positions along the waferscan motion path as calculated in the step 408. A process flow diagramof the first exemplary 3D wafer scanning process 700 is shown in FIG.24.

Exemplary 3D Wafer Scanning Process 700

In a step 702 of the 3D wafer scanning process, thin line illuminationis supplied by or emitted from the thin line illuminator 52. In a step704, the thin line illumination is directed at the inspection positionby the mirror setup 54.

In a subsequent step 706, the thin line illumination is reflected by thesemiconductor wafer 12, or portion thereof, positioned at the inspectionposition. Reflected thin line illumination from the semiconductor wafer12 is transmitted through the 3D profile objective lens 58 which hasaberration corrected in infinity, in a step 708. Transmission of thethin line illumination through the 3D profile objective lens 58 in thestep 708 collimates the thin line illumination.

In a step 710, the collimated thin line illumination then passes throughthe tube lens 60 before entering the 3D profile camera 56 in a step 712.The tube lens 60 preferably focuses the collimated thin lineillumination onto the image capture plane of the 3D profile camera 56.Thin line illumination focused on the 3D image capture plane enablescapture of a first 3D profile image of the semiconductor wafer 12 in astep 714. Collimation of the thin line illumination between the 3Dprofile objective lens 58 and the tube lens 60 facilitates ease ofintroduction of optical components or accessories therebetween, andenable flexible positioning and reconfiguration of the 3D profile camera56.

As previously mentioned, the thin line illumination is supplied by alaser or broadband fiber optic illumination source. In addition, thethin line illumination is preferably directed at the inspection positionat a specified angle with reference to a horizontal plane of thesemiconductor wafer 12 positioned thereat. The angle at which the thinline illumination is directed at the inspection position is preferablyvariable as required using techniques known to a person skilled in theart. It will also be appreciated by a person skilled in the art that thewavelength of the thin line illumination may be selected, and varied, asrequired. Preferably, the broadband wavelength of the thin lineillumination is selected for enhancing accuracy of at least one ofdefect detection, verification, and classification.

The first 3D image is converted to image signals and transmitted to theCPU in a step 716. In a step 718, the first 3D image is processed by theCPU for at least one of 3D height measuring, Coplanarity measuring,detecting and classifying a defect.

Preferably the steps 702 to 718 can be repeated any number of times forcapturing a corresponding number of 3D images, and for transmitting thecaptured 3D images to the CPU. The steps 702 to 718 can be performedeither at selected image capture positions along the wafer scan motionpath or the whole wafer.

Preferably, the first 3D wafer scanning process 700 enhances accuracywith which the exemplary method 300 inspects a semiconductor wafer. Morespecifically, the first 3D wafer scanning process 700 enhances accuracyof defect detection by the method 300.

Such inspection provides details 3D metrological details suchcoplanarity, height of three dimensional structures such as solderballs, gold bumps, warpage of individual die as well as whole wafer.

Preferably, results of the step 718, and repetitions thereof, ofprocessing of 3D images are saved in the database of the CPU.Alternatively, results of the step 718, and repetitions thereof, ofprocessing of 3D images are saved in an alternative database or memoryspace as required.

An exemplary second three-dimensional (3D) wafer scanning process 750can also be used instead of the first exemplary 3D wafer scanningprocess 700. The optical ray path of the exemplary second 3D waferscanning process 750 is shown in FIG. 25 and a corresponding processflow diagram of the exemplary second 3D wafer scanning process 750 is asshown in FIG. 26.

In a step 752 of the second 3D wafer scanning process 750, the thin lineilluminator 52 supplies thin line illumination. In a step 754, the thinline illumination is directed at the inspection position by a reflectorassembly 80. The reflector assembly 80 is alternatively known as a prismassembly or a two mirror or prism setup.

In a step 756, the thin line illumination is reflected by thesemiconductor wafer 12. Thin line illumination reflected by thesemiconductor wafer 12 can be reflected in different directionsdepending on the surface profile of the semiconductor wafer 12. Forexample, structural and geometrical variations on the semiconductorwafer 12 can cause the thin line illumination to be reflected by thesemiconductor wafer 12 in different directions (otherwise known asdispersion of illumination).

Depending upon the surface profile of the semiconductor wafer 12, thereflected thin line illumination from the semiconductor wafer 12 candisperse in different directions. Dispersion of the thin lineillumination reflected from the semiconductor wafer 12 in multipledirections can make it difficult to obtain an accurate measurement ofthe surface profile of the semiconductor wafer 12. In other words, thedispersion of thin line illumination reflected from the semiconductorwafer 12 in multiple directions can make it difficult to captureaccurate 3D images of the semiconductor wafer 12. This is because thedispersion of the thin line illumination reflected from thesemiconductor wafer 12 in multiple directions can result ininappropriately reduced or increased amount of thin line illuminationentering the 3D profile camera 56, and thereby in the capture of dimmeror brighter images respectively. It is difficult to derive accuratemeasurements from images that are too dim or too bright. Accordingly, itis difficult to obtain an accurate surface profile of the semiconductorwafer 12 using images that are too dim or too bright.

Thin line illumination reflected by the semiconductor wafer 12 isreceived by the reflector assembly 80. More specifically, the reflectorassembly 80 is configured for capturing thin line illumination reflectedin multiple directions. Preferably, the reflector assembly 80 comprisesa first pair of mirrors or prisms 82 and a second pair of mirrors orprisms 84. In a step 758, reflected thin line illumination travels alongtwo optical paths, namely a first optical path via, or as directed by,the first pair of mirrors or prisms 82 and a second optical path via, oras directed by, the second pair of mirrors or prisms 84. It will beunderstood by a person skilled in the art that the reflector assemblycan be configured for directing captured reflected thin lineillumination along a different number optical paths as required.

The thin line illumination traveling along each of the first opticalpath and the second optical path passes through the objective lens 58 ina step 760. The two thin line illuminations passing through the 3Dprofile objective lens 58 are collimated. The first pair of mirrors orprisms 82 and the second pair of mirrors or prisms 84 are preferablysymmetrically positioned.

In a step 762, the two collimated thin line illuminations passes throughthe tube lens 60. The two thin line illuminations then enters the 3Dprofile camera 56 in a step 764. The tube lens 60 facilitates focusingof the two thin line illuminations onto the image capture plane of the3D profile camera 56. Focusing of the two thin line illuminations ontothe image capture plane of the 3D profile camera 56 enables capture oftwo views of a 3D profile image of the semiconductor wafer 12 in a step766.

Without the use of the reflector assembly 80, the dispersion of the thinline illumination reflected from the semiconductor wafer 12 in multipledirections can result in inappropriately reduced or increased amount ofthin line illumination entering the 3D profile camera 56, and thereby incapture of images that are too dim or too bright respectively. Suchimages are typically discarded. The use of images that are too dim ortoo bright can result in an inaccurate 3D profiling, or measurement ofthe surface profile, of the semiconductor wafer 12.

The ability of the system 10 to perform the second 3D wafer scanningprocess 750 enables capture of two views of the 3D profile of thesemiconductor wafer 12 using a single 3D image capture device 56. Thetwo views improve accuracy of the 3D profiling or inspection of thewafer. In addition, the use of the two symmetrically positioned mirrorsor prisms 82, 84 enables illumination reflected from the semiconductorwafer 12 in different directions to be re-directed for capture by the 3Dimage capture device 56. It will be understood by a person skilled inthe art that the reflector assembly 80 can be configured for directingillumination reflected from the semiconductor wafer 12 in multipledirections (for example, two, three, four and five directions) to becaptured by a single exposure of the 3D image capture device 56.

To receive two views of the same profile of wafers, existing equipmentsuse expensive, bulky and complicated setup by using multiple imagecapture devices. Due to the inconsistent profile of wafers, reflectedrays do not consistently return in a pre-determined ray path to themultiple image capture devices. This is to say, the dispersion ofillumination due to structural and geometrical variations on the surfaceof the semiconductor wafer 12 typically results in inaccuracies insingle view images captured of the semiconductor wafer 12.

To overcome the variation of the strength and weakness (i.e. thedispersion) of the reflected rays from the semiconductor wafers 12, thepresent system 10 enables illumination reflected from the semiconductorwafer 12 in different directions to be captured by the 3D image capturedevice 56. This helps to improve accuracy of 3D profiling and inspectionof the semiconductor wafer 12. The use of a single camera, morespecifically the 3D image capture device 56, also enhances cost andspace efficiency of the system 10. Furthermore, the ability to use asingle objective lens and a single tube lens (in this case, theobjective lens 58 and tube lens 60) for capturing multiple views of thesemiconductor wafer 12 enhances ease and accuracy of calibration.

After completion of the first exemplary 3D wafer scanning process 700 orthe second exemplary 3D wafer scanning process 750, all the detecteddefects, and the locations and classifications thereof, on thesemiconductor wafer 12 obtained by performing the steps 416 and 418 arepreferably consolidated. The consolidation of the defects, and thelocations and classifications thereof, facilitates calculation of areview scan motion path in a step 420. Preferably, the review scanmotion path is calculated based on the locations of defects detected onthe semiconductor wafer 12 along the wafer scan motion path. Inaddition, defect image capture positions along the review scan motionpath is calculated or determined in the step 420. The defect imagecapture positions preferably correspond with the locations on thesemiconductor wafer 12 at which defects were detected (i.e. the DROI ofthe semiconductor wafer 12) during the steps 416 and 418.

In a step 422 of the exemplary method 400, an exemplary review process800 is performed. The review process 800 enables review of defectsdetected in the steps 416 and 418. Preferably, the review process 800occurs via at least one of a first mode 800 a, a second mode 800 b and athird mode 800 c. A process flow chart of the exemplary review process800 is shown in FIG. 27.

Exemplary Review Process 800

As previously mentioned, the review process 800 preferably comprisesthree review modes, namely the first mode 800 a, the second mode 800 band the third mode 800 c. In a step 802, a review mode (i.e. one thefirst mode 800 a, the second mode 800 b and the third mode 800 c) isselected.

First Mode 800 a of the Review Process 800

In a step 804 of the first mode 800 a of the review process 800, thefirst images and the second images of all the defects detected duringthe 2D image processing process 600 performed in the step 416 of themethod 400 are consolidated and saved.

In a step 806, the consolidated and saved first images and second imagesof the defects detected on the semiconductor wafer 12 are uploaded ortransferred to an external storage or server for an offline review.

In a step 808, the semiconductor wafer 12 (i.e. the currentsemiconductor wafer 12 on the wafer table 16) is unloaded and a secondwafer is loaded from the wafer stack 20 onto the wafer table 16 by therobotic arm. In a step 810, each of the steps 804 to 808 is repeated forthe second wafer.

The steps 804 to 810 are sequentially repeated any number of times,depending on the number of wafers of the wafer stack 20. Repetition ofthe step 804 to 810 results in consolidation and saving of the firstimages and second images obtained for each wafer of the wafer stack 20,and the uploading of the first images and the second images, to theexternal storage or server for an offline review. It will be appreciatedby a person skilled in the art that the first mode 800 a enablesautomated performance of the steps 804 to 810 without need for userintervention and without affecting production. This method allowscontinuing production while user can perform offline review of savedimages. This method increases system 10 utilization as well asproductivity.

Second Mode 800 b of the Review Process 800

In a step 820 the second mode 800 b of the review process 800, a numberof review images is captured at each of the defect image capturepositions as calculated in the step 420. More specifically, a reviewbrightfield image and a review darkfield image are captured at each ofthe defect image capture positions as calculated in the step 420 usingreview image capture device 60 shown in FIG. 14. This is to say s reviewbrightfield image using brightfield illuminator 62 and a reviewdarkfield image using darkfield illuminator 64 are captured of eachdefect detected by the 2D image processing process 600 of the step 416.Each of the number of review images is captured by the review imagecapture device 60. Preferably, each of the number of review images is acolored image.

It will be understood by a person skilled in the art, provided with thedisclosure of the present description that intensities of thebrightfield illumination and darkfield illumination used for capturingthe brightfield review images and darkfield review images respectivelymay be determined and varied as required. For example, the intensitiesof illumination used for capturing the number of review images may beselected based on type of wafer defect the user of the system 10 wishesto review or based on the material of semiconductor wafer 12. It is alsopossible to capture multiple review images using various combinationsand various intensity levels of brightfield and darkfield illuminationset by the user.

In a step 822, the number of review images captured at each of thedefect image capture positions as calculated in the step 420 areconsolidated and saved. The consolidated and saved review imagescaptured at each of the defect image capture positions are then uploadedto the external storage or server for offline review in a step 824.

In a step 826, the semiconductor wafer 12 (i.e. the currentsemiconductor wafer 12 on the wafer table 16) is unloaded and a secondsemiconductor wafer 12 is loaded from the wafer stack 20 onto the wafertable 16 by the robotic wafer handler 18. In a step 828, each of thesteps 402 to 422 is repeated for the second semiconductor wafer 12.Consolidated and saved first images and second images of defectsdetected on the second semiconductor wafer 12 are uploaded to theexternal storage or server.

In the second mode 800 b of the review process 800, the steps 820 to 828can be repeated any number of times, depending on the number ofsemiconductor wafer 12 of the wafer stack 20. Repetition of the steps820 to 828 results in consolidation and saving of the capturedbrightfield review images and darkfield review images obtained for eachwafer of the wafer stack 20, and the uploading of the first images andthe second images, to the external storage or server for an offlinereview.

This method allows continuing production while user can perform offlinereview of saved images. This method allows capturing multiple images ofeach defect at various combinations illuminations for offline reviewwithout affecting machine utilization and improves productivity.

Third Mode 800 c of the Review Process 800

The third mode 800 c of the review process 800 is preferably initializedby a manual input, more specifically an input or command by the user. Ina step 840, the user captures a first review brightfield image and afirst review darkfield image at a first defect image capture position.In a step 842, the user manually inspects or reviews the first reviewbrightfield image and the first review darkfield image captured.Preferably, the first review brightfield image and the first reviewdarkfield image are displayed on a screen or monitor for facilitatingvisual inspection thereof by the user. The user is able to view thedefect at different illumination combination using the brightfield andthe darkfield illuminator.

In a step 844, the user either accepts or rejects or reclassifies thedefect corresponding to the first defect image capture position. Thesteps 840 to 844 are then sequentially repeated for each and everydefect image capture positions as calculated in the step 420.

After the steps 840 to 844 are sequentially repeated for each and everydefect image capture positions, positive defects and theirclassifications are then consolidated and saved in a step 846. Theconsolidated and saved positive defects and their classifications arethen uploaded or transferred to the external storage or server in a step848. In the third mode 800 c of the review process 800, thesemiconductor wafer 12 (i.e. the current semiconductor wafer 12 on thewafer table 16) is only unloaded after the completion of the step 846.Accordingly, it will be appreciated by a person skilled in the art thatthe third mode 800 c of the review process requires continuous userpresence for effecting the visual inspection or review of each wafer.

In a step 848 of the review process 800, the semiconductor wafer 12(i.e. the current semiconductor wafer 12 on the wafer table 16) isunloaded and the robotic wafer handler 18 then loads a secondsemiconductor wafer 12 onto the wafer table 16 from the wafer stack 20.The steps 840 to 848 are repeated any number of times depending on thenumber of semiconductor wafers 12 to be inspected (or number ofsemiconductor wafers 12 in the wafer stack 20).

It will be understood by a person skilled in the art with the disclosureprovided by the description above that the first mode 800 a and thesecond mode 800 b of the review process effects a relativelyindiscriminate consolidation, storage and uploading of captured imagesto the external storage or server. The first mode 800 a and the secondmode 800 b represent automated review processes. The user is able toaccess the external storage or server for offline review of the capturedimages as and when required. The first mode 800 a and the second mode800 b enable continuous review of each of the wafers of the wafer stack20, or the continuous image capture, consolidation, upload and storage.

It will be appreciated by a person skilled in the art that while onlythree review modes, namely the first mode 800 a, the second mode 800 band the third mode 800 c are described in the present description, aperson skilled in the art may employ alternative review processes ordifferent permutations or combinations of the steps of each of the threereview modes 800 a, 800 b and 800 c. In addition, it will be appreciatedby a person skilled in the art that each of the three review modes 8000a, 800 b and 800 c may be modified or altered as required using methodsknown in the art without departing from the scope of the presentinvention.

After the performance of the review process 800, verified defects, andthe locations and classifications thereof, are consolidated and saved ina step 426. The verified defects, and the locations and classificationsthereof, are consolidated and saved either in the database or in anexternal database or memory space. The wafer map is also updated in thestep 426.

As previously described, each of the captured brightfield images, DHAimages and DLA images is compared with a corresponding golden referenceor reference image for identifying or detecting defects on thesemiconductor wafer 12. The exemplary reference image creation process900 provided by the present invention (as shown in FIG. 18) facilitatescreation or derivation of such reference images. It will be understoodby a person skilled in the art that the reference image creation process900 can also be referred to as a training process.

As previously described, each of the 2D brightfield images, 2D DHAimages, 2D DLA images captured during the 2D wafer scanning process 500are preferably matched with their corresponding reference images createdby the reference image creation process 900.

An exemplary comparison process is already described with the 2D imageprocessing process 600. However, for increased clarity, a summary ofmatching between working images and reference images is provided below.Firstly, subpixel alignment of the selected working image is performedusing known references including, but not limited to, templates, trace,bumps, pads and other unique patterns. Secondly, the reference intensityof the semiconductor wafer 12 at the image capture position at which theworking image was captured is calculated. An appropriate reference imagefor matching with the working image is then selected. The appropriatereference image is preferably selected from the multiple referenceimages created by the reference image creation process 900.

The CPU is preferably programmed for enabling selection and extractionof the appropriate reference image to which the working image will bematched. Preferably, the calculation, and storage, of the normalizedaverage or geometric mean, standard deviation, maximum and minimumintensity of each pixel of the reference images by the reference imagecreation process 900 enhances speed and accuracy of extracting theappropriate reference image to which the working image will be compared.

Corresponding quantitative data for each pixel of the working image isthen calculated. The quantitative data is for example normalized averageor geometric mean, standard deviation, maximum and minimum intensitiesof each pixel of the working image. The quantitative data values foreach pixel of the working image is then referenced or checked againstcorresponding data values of each pixel of the selected reference image.

Comparison of quantitative data values between pixels of the workingimage and pixels of the reference image enables identification ordetection of defects. Preferably, predetermined threshold values are setby the user. Difference between the quantitative data values of pixelsof the working image and pixels of the reference image is matchedagainst the predetermined threshold values with one of multiplicative,additive and a constant value. If the difference between thequantitative data values of pixels of the working image and pixels ofthe reference image is greater than the predetermined threshold values,a defect (or defects) is flagged.

The predetermined threshold value can be varied as required. Preferably,the predetermined threshold value is varied for adjusting stringency ofthe method 400. In addition, the predetermined threshold value ispreferably varied as required depending on type of defect to bedetected, material of semiconductor wafer 12 presented for inspection,or illumination conditions. Furthermore, the predetermined thresholdvalue may be altered depending on a customer's or more generally thesemiconductor industry's, requirements.

An exemplary system 10 and an exemplary method 400 for inspectingsemiconductor wafers are described above. A person skilled in the artprovided with the description above will understand that themodifications to the system 10 and the method 400 may be done withoutdeparting from the scope of the present invention. For example, sequenceof steps of the method 400, and the sequence of steps of processes 500,600, 700, 750, 800 and 900, may be modified without departing from thescope of the present invention.

It is an objective of the system 10 and method 400 of the presentinvention to enable accurate and cost-effective inspection ofsemiconductor wafers. The ability for an automated inspection ofsemiconductor wafers by the system 10 and the method 400 while thesemiconductor wafer is in motion enhances efficiency of the inspectionof semiconductor wafers. This is because time is not wasted fordecelerating and stopping of individual semiconductor wafers at aninspection position for image capture thereof, and for subsequentacceleration and transport of the semiconductor wafer from theinspection position after the images have been captured, as with severalexisting semiconductor wafer inspection systems. Known image offsetsbetween multiple image captures facilitate processing of the capturedimages to thereby detect defects that may be present therein. The offsetrelative to the particular set of images for the same semiconductorwafer enables the software to accurately determine the co-ordinates ofthe defect in the semiconductor wafer and, subsequently, the position ofthe semiconductor wafer in the entire frame. The offset is preferablydetermined by reading the encoder values in both the X- andY-displacement motors and is used to calculate the co-ordinates of adefect or defects. In addition, the use of two images at every inspectlocations combines advantages of two different imaging techniques forfacilitating more accurate semiconductor wafer inspection.

It will also be understood by a person skilled in the art that thetime-synchronization of image captures can be altered as required. Morespecifically, the time-synchronization may be adjusted for enhancing theability of the programmable controller to compensate for image offsetbetween the captured images. The system 10 and method 400 of the presentinvention facilitates accurate synchronization between supply ofillumination and exposure of corresponding image capture devices forcapturing of images to minimize degradation of inspection quality.

Illuminations used with the system 10 can be in the full visiblespectrum of light for capture of enhanced quality images. Intensities ofillumination and their combinations supplied for capture of images bythe system 10 can be easily selected and varied as required depending onfactors including, but not limited to, type of defects to be detected,material of the semiconductor wafer and stringency of semiconductorwafer inspection. The system 10 and method 400 provided by the presentinvention also enables measurement of height of 3D elements on thesemiconductor wafer, and analysis of 3D profile images while thesemiconductor wafer is moving.

The system 10 of the present invention has an optical setup (i.e.optical inspection head 14), which does not require frequent spatialreconfigurations to cater to changes in semiconductor wafer structure orcharacteristics. In addition, the use of tube lenses with the system 10enables ease of reconfiguration and design of the system 10, morespecifically of the optical inspection head 14. The use of tube lensesenhances ease of introduction of optical components and accessories intothe system, more specifically between objective lenses and the tubelenses.

The system 10 of the present invention comprises vibration isolators 24(collectively known as a stabilizer mechanism) for buffering unwantedvibrations to the system 10. The vibration isolators 24 helps to enhancequality of images captured by the first image capture device 32, thesecond image capture device 34, the 3D profile camera and the reviewimage capture device 62, and thus the accuracy of defect detection. Inaddition, the XY-displacement table 22 of the system 10 enables accuratedisplacement and alignment of the semiconductor wafer relative theinspection position.

As described in the background, existing reference image derivation orcreation processes requires manual selection of “good” semiconductorwafers, resulting in relative inaccuracies and inconsistencies ofderived reference images. Accordingly, quality of semiconductor waferinspection is adversely affected. The system 10 and method 400 of thepresent invention achieves enhanced quality of inspection by creatingreference images without manual selection (i.e. subjective selection) of“good” semiconductor wafers. The reference image creation process 900allows for application of different thresholds of intensities acrossdifferent locations of the semiconductor wafer, thus accommodatingnon-linear illumination variations across the semiconductor wafer. Themethod 400 therefore facilitates reduction in false or unwanteddetection of defects and ultimately an enhanced quality of semiconductorwafer inspection.

The present invention enables automated defect detection using ananalytical model that compares reference images with captured images ofunknown quality semiconductor wafers. The present invention also enablesautomated defect detection, preferably by performing digital analysis ondigitalized images (i.e. working images and reference images).

The present invention enables automated review mode (or on offlinereview) without affecting production and improves machine utilization,whereas the existing equipment offers only manual review mode, whichrequire the operator to decide every defect by using and looking atmultiple different illumination intensities.

In the foregoing manner, an exemplary system and an exemplary method forinspecting semiconductor wafers and components provided by embodimentsof the present invention are described. The exemplary system and methodaddresses at least one of the issues or problems faced by existingsemiconductor inspection systems and methods as mentioned in thebackground. It will however be understood by a person skilled in the artthat the present invention is not limited to specific forms,arrangements or structures of the embodiments described above. It willbe apparent to a person skilled in the art in view of this disclosurethat numerous changes and/or modifications can be made without departingfrom the scope and spirit of the invention.

The invention claimed is:
 1. A method for optically inspecting objects,comprising: providing an inspection illumination setup configured forautomatically outputting a first contrast inspection illuminationsequentially followed by a second contrast inspection illumination;providing a review illumination setup comprising first and seconddistinct review illuminators, the first review illuminator configuredfor outputting brightfield illumination and the second reviewilluminator configured for outputting darkfield illumination; providinga first inspection image capture device and a distinct second inspectionimage capture device; providing a review image capture device;calculating an inspection scan motion path for an object; performing aninspection process corresponding to multiple selected portions of theobject as the object is displaced in one pass along the inspection scanmotion path, the inspection process comprising repeatedly: capturing afirst inspection image of a selected portion of the object currentlyunder consideration with the first image capture device simultaneouslywith the output of the first contrast inspection illumination as theobject is displaced in the one pass along the inspection scan motionpath, and followed by capturing a second inspection image of theselected portion of the object currently under consideration with thesecond image capture device simultaneously with the output of the secondcontrast inspection illumination as the object is displaced in the onepass along the inspection scan motion path, until first inspectionimages and second inspection images of each selected portion of theobject within the multiple selected portions of the object have beencaptured; performing a defect identification process for each selectedportion of the object within the multiple selected portions of theobject, the defect identification process comprising: automaticallyanalysing the first inspection image corresponding to the selectedportion of the object for the presence of a defect, and when thepresence of a defect in the first inspection image is indicated based onanalysing the first image: determining a defect region of interest(DROI) corresponding to an area of the first inspection image at whichthe defect is indicated, automatically analysing a selected area in thesecond inspection image corresponding to the DROI instead of analysingthe entire second inspection image to determine whether the defect isindicated in the selected area of second inspection image, andestablishing a positive defect identification for the selected portionof the object when the defect is indicated in the selected area of thesecond inspection image, and establishing a negative defectidentification otherwise; calculating a review scan motion path based onthose selected object portions of the object for which positive defectidentifications occurred; and performing a defect review processcorresponding to the object, the defect review process comprising: foreach selected portion of the object having a positive defectidentification, capturing each of a brightfield review image and adarkfield review image of the selected portion of the object using thereview image capture device while the object is in motion.
 2. The methodof claim 1, further comprising: capturing multiple reference images ofat least one region of the object using the review image capture deviceand at least one of the first image capture device and the second imagecapture device; and mathematically deriving golden reference images fromthe captured reference images.
 3. The method of claim 1, whereinautomatically analysing the first inspection image corresponding to theselected portion of the object comprises comparing the first inspectionimage with the golden reference image.
 4. The method of claim 1, furthercomprising: for a first portion of the object having a positive defectidentification, presenting a brightfield review image and a darkfieldreview image corresponding to the first portion of the object on adisplay device.
 5. The method of claim 4, wherein the brightfield reviewimage and the darkfield review image are presented adjacent to eachother on the display device.
 6. The method of claim 1, wherein each ofthe first contrast inspection illumination and the second contrastinspection illumination is selected from a range of contrast inspectionillumination types including each of brightfield illumination, darkfieldillumination, a first combination of brightfield illumination, and asecond distinct combination of brightfield illumination and darkfieldillumination.
 7. The method of claim 1, further comprising providing aset of optical elements comprising an objective lens through which thefirst image capture device and the second image capture device share acommon field of view of each selected portion of the object currentlyunder consideration during the capture of each first inspection image bythe first image capture device and the capture of each second inspectionimage by the second image capture device.
 8. A system for opticalinspection of objects, comprising: an inspection illumination setupconfigured for automatically outputting a first contrast inspectionillumination sequentially followed by a second contrast inspectionillumination; a review illumination setup comprising first and seconddistinct review illuminators, the first review illuminator configuredfor outputting brightfield illumination and the second reviewilluminator configured for outputting darkfield illumination; a firstinspection image capture device; a second inspection image capturedevice distinct from the first inspection image capture device; a reviewimage capture device; a processing unit coupled to a memory and adatabase, the processing unit configured for: calculating an inspectionscan motion path for an object, performing an inspection processcorresponding to multiple selected portions of the object as the objectis displaced in one pass along the inspection scan motion path, theinspection process comprising repeatedly: capturing a first inspectionimage of a selected portion of the object currently under considerationwith the first image capture device simultaneously with the output ofthe first contrast inspection illumination as the object is displaced inthe one pass along the inspection scan motion path, and followed bycapturing a second inspection image of the selected portion of theobject currently under consideration with the second image capturedevice simultaneously with the output of the second contrast inspectionillumination as the object is displaced in the one pass along theinspection scan motion path, until first inspection images and secondinspection images of each selected portion of the object within themultiple selected portions of the object have been captured; performinga defect identification process for each selected portion of the objectwithin the multiple selected portions of the object, the defectidentification process comprising: automatically analysing the firstinspection image corresponding to the selected portion of the object forthe presence of a defect, and when the presence of a defect in the firstinspection image is indicated based on analysing the first image:determining a defect region of interest (DROI) corresponding to an areaof the first inspection image at which the defect is indicated,automatically analysing a selected area in the second inspection imagecorresponding to the DROI instead of analysing the entire secondinspection image to determine whether the defect is indicated in theselected area of second inspection image, and establishing a positivedefect identification for the selected portion of the object when thedefect is indicated in the selected area of the second inspection image,and establishing a negative defect identification otherwise; calculatinga review scan motion path based on those selected object portions of theobject for which positive defect identifications occurred; andperforming a defect review process corresponding to the object, thedefect review process comprising: for each selected portion of theobject having a positive defect identification, capturing each of abrightfield review image and a darkfield review image of the selectedportion of the object using the review image capture device while theobject is in motion.
 9. The system of claim 8, wherein the processingunit is further configured for generating a mathematically derivedgolden reference image by way of: directing the capture of multiplereference images of at least one region of the object using the reviewimage capture device and at least one of the first image capture deviceand the second image capture device; and mathematically deriving thegolden reference image from the captured reference images.
 10. Thesystem of claim 9, wherein the processing unit is further configured forautomatically analysing the first inspection image corresponding to theselected portion of the object by comparing the first inspection imagewith the golden reference image.
 11. The method of claim 8, furthercomprising a display device configured for presenting a brightfieldreview image corresponding to a first portion of the object having apositive defect identification and a darkfield review imagecorresponding to the first portion of the object.
 12. The method ofclaim 11, wherein the display device is configured for presenting thebrightfield review image and the darkfield review image adjacent to eachother.
 13. The system of claim 1, wherein the inspection illuminationsetup is configured for selecting each of the first contrast inspectionillumination and the second contrast inspection illumination from arange of contrast inspection illumination types including each ofbrightfield illumination, darkfield illumination, a first combination ofbrightfield illumination, and a second distinct combination ofbrightfield illumination and darkfield illumination.
 14. The method ofclaim 1, further comprising a set of optical elements including anobjective lens through which the first image capture device and thesecond image capture device share a common field of view of eachselected portion of the object currently under consideration during thecapture of each first inspection image by the first image capture deviceand the capture of each second inspection image by the second imagecapture device.